Wang; Wen-De

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wang; Wen-De.The latest application filed is for "seal ring structures and methods of forming same".

Company Profile

16.96.90

Wang; Wen-De - Minsyong Township TW
WANG; WEN-DE - CHIAYI COUNTY TW
Wang; Wen-De - Minsyoung Township TW
Wang; Wen-De - Minsyong Township, Chiayi County N/A TW
Wang; Wen-De - Chiayi TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Seal Ring Structures And Methods Of Forming Same App 20220278090 - Wu; Kuo-Ming ; et al.	2022-09-01
High Capacitance Mim Device With Self Aligned Spacer App 20220238636 - Chu; Ching-Sheng ; et al.	2022-07-28
Seal ring structures and methods of forming same Grant 11,342,322 - Wu , et al. May 24, 2	2022-05-24
Implant isolated devices and method for forming the same Grant 11,114,486 - Kao , et al. September 7, 2	2021-09-07
Back Side Illuminated Image Sensor with Reduced Sidewall-Induced Leakage App 20210143208 - Tsai; Shuang-Ji ; et al.	2021-05-13
Vertically integrated image sensor chips and methods for forming the same Grant 10,991,752 - Lin , et al. April 27, 2	2021-04-27
Image sensor device and method of forming same Grant 10,879,297 - Wang , et al. December 29, 2	2020-12-29
Seal Ring Structures And Methods Of Forming Same App 20200350302 - Wu; Kuo-Ming ; et al.	2020-11-05
Seal ring structures and methods of forming same Grant 10,727,218 - Wu , et al.	2020-07-28
Semiconductor Device Structure And Method For Manufacturing The Same App 20200144244 - HO; CHENG-YING ; et al.	2020-05-07
Back Side Illuminated Image Sensor with Reduced Sidewall-Induced Leakage App 20200144325 - Tsai; Shuang-Ji ; et al.	2020-05-07
3DIC Seal Ring Structure and Methods of Forming Same App 20200119074 - Ho; Cheng-Ying ; et al.	2020-04-16
Back side illuminated image sensor with reduced sidewall-induced leakage Grant 10,566,378 - Tsai , et al. Feb	2020-02-18
Pad structure exposed in an opening through multiple dielectric layers in BSI image sensor chips Grant 10,535,696 - Lin , et al. Ja	2020-01-14
Semiconductor device structure Grant 10,522,525 - Ho , et al. Dec	2019-12-31
3DIC seal ring structure and methods of forming same Grant 10,510,792 - Ho , et al. Dec	2019-12-17
Seal ring structures and methods of forming same Grant 10,453,832 - Wu , et al. Oc	2019-10-22
Image Sensor Device and Method of Forming Same App 20190244999 - Wang; Wen-De ; et al.	2019-08-08
Image sensor device and method of forming same Grant 10,290,671 - Wang , et al.	2019-05-14
Vertically Integrated Image Sensor Chips and Methods for Forming the Same App 20190123092 - Lin; Jeng-Shyan ; et al.	2019-04-25
Seal Ring Structures And Methods Of Forming Same App 20190109125 - Wu; Kuo-Ming ; et al.	2019-04-11
Vertically integrated image sensor chips and methods for forming the same Grant 10,157,958 - Lin , et al. Dec	2018-12-18
Isolation for semiconductor devices Grant 10,128,304 - Hsu , et al. November 13, 2	2018-11-13
Implant isolated devices and method for forming the same Grant 10,008,532 - Kao , et al. June 26, 2	2018-06-26
Seal Ring Structures And Methods Of Forming Same App 20180175012 - Wu; Kuo-Ming ; et al.	2018-06-21
Vertically Integrated Image Sensor Chips and Methods for Forming the Same App 20180108703 - Lin; Jeng-Shyan ; et al.	2018-04-19
Deep trench isolation structure in image sensor device Grant 9,935,147 - Chen , et al. April 3, 2	2018-04-03
Semiconductor Device Structure App 20180053756 - HO; CHENG-YING ; et al.	2018-02-22
3DIC Seal Ring Structure and Methods of Forming Same App 20180033817 - Ho; Cheng-Ying ; et al.	2018-02-01
Image Sensor Device And Method Of Forming Same App 20180026069 - Wang; Wen-De ; et al.	2018-01-25
Vertically integrated image sensor chips and methods for forming the same Grant 9,847,368 - Lin , et al. December 19, 2	2017-12-19
Backside structure and methods for BSI image sensors Grant 9,837,464 - Chuang , et al. December 5, 2	2017-12-05
Method of manufacturing a semiconductor device Grant 9,818,735 - Ho , et al. November 14, 2	2017-11-14
Seal ring structure with a metal pad Grant 9,812,409 - Lin , et al. November 7, 2	2017-11-07
3DIC seal ring structure and methods of forming same Grant 9,806,119 - Ho , et al. October 31, 2	2017-10-31
Image sensor device and method of forming same Grant 9,773,828 - Wang , et al. September 26, 2	2017-09-26
Implant Isolated Devices and Method for Forming the Same App 20170271386 - Kao; Min-Feng ; et al.	2017-09-21
Pad Structure Exposed In An Opening Through Multiple Dielectric Layers In Bsi Image Sensor Chips App 20170250215 - Lin; Jeng-Shyan ; et al.	2017-08-31
Backside Structure and Methods for BSI Image Sensors App 20170162622 - Chuang; Chun-Chieh ; et al.	2017-06-08
Implant isolated devices and method for forming the same Grant 9,673,245 - Kao , et al. June 6, 2	2017-06-06
Dual metal for a backside package of backside illuminated image sensor Grant 9,673,246 - Chuang , et al. June 6, 2	2017-06-06
Back Side Illuminated Image Sensor with Reduced Sidewall-Induced Leakage App 20170154918 - Tsai; Shuang-Ji ; et al.	2017-06-01
Pad structure exposed in an opening through multiple dielectric layers in BSI image sensor chips Grant 9,653,508 - Lin , et al. May 16, 2	2017-05-16
Backside structure and methods for BSI image sensors Grant 9,613,996 - Chuang , et al. April 4, 2	2017-04-04
Deep Trench Isolation Structure In Image Sensor Device App 20170069670 - CHEN; Hsin-Hung ; et al.	2017-03-09
Backside structure and methods for BSI image sensors Grant 9,576,999 - Chuang , et al. February 21, 2	2017-02-21
Ridge structure for back side illuminated image sensor Grant 9,570,503 - Chuang , et al. February 14, 2	2017-02-14
Back side illuminated image sensor having isolated bonding pads Grant 9,570,497 - Tsai , et al. February 14, 2	2017-02-14
Method of fabricating deep trench isolation structure in image sensor and device thereof Grant 9,520,433 - Chen , et al. December 13, 2	2016-12-13
Backside Structure and Methods for BSI Image Sensors App 20160336367 - Chuang; Chun-Chieh ; et al.	2016-11-17
Image sensor structure to reduce cross-talk and improve quantum efficiency Grant 9,455,288 - Tsai , et al. September 27, 2	2016-09-27
Pad Structure Exposed in an Opening Through Multiple Dielectric Layers in BSI Image Sensor Chips App 20160260764 - Lin; Jeng-Shyan ; et al.	2016-09-08
Implant Isolated Devices and Method for Forming the Same App 20160233257 - Kao; Min-Feng ; et al.	2016-08-11
Backside Structure and Methods for BSI Image Sensors App 20160218126 - Chuang; Chun-Chieh ; et al.	2016-07-28
Backside structure and methods for BSI image sensors Grant 9,401,380 - Chuang , et al. July 26, 2	2016-07-26
Pad structure exposed in an opening through multiple dielectric layers in BSI image sensor chips Grant 9,362,329 - Lin , et al. June 7, 2	2016-06-07
Implant isolated devices and method for forming the same Grant 9,355,888 - Kao , et al. May 31, 2	2016-05-31
Backside structure for BSI image sensor Grant 9,356,058 - Chuang , et al. May 31, 2	2016-05-31
Backside structure and method for BSI image sensors Grant 9,305,966 - Chuang , et al. April 5, 2	2016-04-05
Isolation for Semiconductor Devices App 20160056202 - Hsu; Wen-I ; et al.	2016-02-25
Back Side Illuminated Image Sensor Having Isolated Bonding Pads App 20160027836 - Tsai; Shuang-Ji ; et al.	2016-01-28
Image Sensor Device And Method Of Forming Same App 20160005780 - WANG; Wen-De ; et al.	2016-01-07
Method Of Manufacturing A Semiconductor Device App 20150364458 - HO; CHENG-YING ; et al.	2015-12-17
Vertically Integrated Image Sensor Chips and Methods for Forming the Same App 20150349003 - Lin; Jeng-Shyan ; et al.	2015-12-03
Pad structures formed in double openings in dielectric layers Grant 9,184,207 - Lin , et al. November 10, 2	2015-11-10
Isolation for semiconductor devices Grant 9,177,986 - Hsu , et al. November 3, 2	2015-11-03
Back side illuminated image sensor having isolated bonding pads Grant 9,165,970 - Tsai , et al. October 20, 2	2015-10-20
CMOS image sensor structure Grant 9,147,703 - Kao , et al. September 29, 2	2015-09-29
Semiconductor device having a bonding pad and shield structure and method of manufacturing the same Grant 9,142,690 - Tsai , et al. September 22, 2	2015-09-22
Pad design for backside illuminated image sensor Grant 9,142,586 - Wang , et al. September 22, 2	2015-09-22
Seal Ring Structure With A Metal Pad App 20150249057 - Lin; Jeng-Shyan ; et al.	2015-09-03
Vertically integrated image sensor chips and methods for forming the same Grant 9,123,615 - Lin , et al. September 1, 2	2015-09-01
Semiconductor device and manufacturing method thereof Grant 9,117,879 - Ho , et al. August 25, 2	2015-08-25
Pad Structure Including Glue Layer and Non-Low-K Dielectric Layer in BSI Image Sensor Chips App 20150228690 - Lin; Jeng-Shyan ; et al.	2015-08-13
3DIC Seal Ring Structure and Methods of Forming Same App 20150194455 - Ho; Cheng-Ying ; et al.	2015-07-09
Pad Structures Formed in Double Openings in Dielectric Layers App 20150194465 - Lin; Jeng-Shyan ; et al.	2015-07-09
Ridge Structure for Back Side Illuminated Image Sensor App 20150187834 - Chuang; Chun-Chieh ; et al.	2015-07-02
Semiconductor Device And Manufacturing Method Thereof App 20150187636 - HO; CHENG-YING ; et al.	2015-07-02
Backside Structure and Method for BSI Image Sensors App 20150140722 - Chuang; Chun-Chieh ; et al.	2015-05-21
Seal ring structure with a metal pad Grant 9,035,445 - Lin , et al. May 19, 2	2015-05-19
Pad structure including glue layer and non-low-k dielectric layer in BSI image sensor chips Grant 9,013,022 - Lin , et al. April 21, 2	2015-04-21
Pad structures formed in double openings in dielectric layers Grant 8,987,855 - Lin , et al. March 24, 2	2015-03-24
Ridge structure for back side illuminated image sensor Grant 8,981,510 - Chuang , et al. March 17, 2	2015-03-17
Backside structure and methods for BSI image sensors Grant 8,969,991 - Chuang , et al. March 3, 2	2015-03-03
Backside illuminated image sensor having capacitor on pixel region Grant 8,895,349 - Chuang , et al. November 25, 2	2014-11-25
Vertically Integrated Image Sensor Chips and Methods for Forming the Same App 20140308772 - Lin; Jeng-Shyan ; et al.	2014-10-16
Backside Structure and Methods for BSI Image Sensors App 20140252523 - Chuang; Chun-Chieh ; et al.	2014-09-11
Front side implanted guard ring structure for backside Grant 8,810,700 - Wang , et al. August 19, 2	2014-08-19
Semiconductor Device Having A Bonding Pad And Shield Structure And Method Of Manufacturing The Same App 20140199804 - Tsai; Shuang-Ji ; et al.	2014-07-17
Vertically integrated image sensor chips and methods for forming the same Grant 8,766,387 - Lin , et al. July 1, 2	2014-07-01
Backside Structure and Methods for BSI Image Sensors App 20140159190 - Chuang; Chun-Chieh ; et al.	2014-06-12
Backside structure and methods for BSI image sensors Grant 8,709,854 - Chuang , et al. April 29, 2	2014-04-29
Semiconductor device having a bonding pad and shield structure of different thickness Grant 8,710,612 - Tsai , et al. April 29, 2	2014-04-29
Implant Isolated Devices and Method for Forming the Same App 20140091377 - Kao; Min-Feng ; et al.	2014-04-03
Implant Isolated Devices and Method for Forming the Same App 20140091375 - Kao; Min-Feng ; et al.	2014-04-03
Image sensor and method of fabricating same Grant 8,674,467 - Wang , et al. March 18, 2	2014-03-18
Isolation for Semiconductor Devices App 20140061737 - Hsu; Wen-I ; et al.	2014-03-06
Bonding pad structure for a backside illuminated image sensor device and method of manufacturing the same Grant 8,664,736 - Tsai , et al. March 4, 2	2014-03-04
Novel CMOS Image Sensor Structure App 20140035013 - Kao; Min-Feng ; et al.	2014-02-06
Backside Illuminated Image Sensor Having Capacitor On Pixel Region App 20140030842 - CHUANG; Chun-Chieh ; et al.	2014-01-30
Front Side Implanted Guard Ring Structure For Backside App 20130334645 - WANG; Wen-De ; et al.	2013-12-19
Backside illuminated image sensor device with refractive index dependent layer thicknesses and method of forming the same Grant 8,604,405 - Liu , et al. December 10, 2	2013-12-10
Vertically Integrated Image Sensor Chips and Methods for Forming the Same App 20130307103 - Lin; Jeng-Shyan ; et al.	2013-11-21
Image Sensor Structure to Reduce Cross-Talk and Improve Quantum Efficiency App 20130307104 - Tsai; Shuang-Ji ; et al.	2013-11-21
Backside Structure for BSI Image Sensor App 20130299931 - Chuang; Chun-Chieh ; et al.	2013-11-14
Backside Structure and Methods for BSI Image Sensors App 20130299886 - Chuang; Chun-Chieh ; et al.	2013-11-14
Backside illuminated image sensor having capacitor on pixel region Grant 8,569,807 - Chuang , et al. October 29, 2	2013-10-29
CMOS image sensor structure Grant 8,564,085 - Kao , et al. October 22, 2	2013-10-22
Front side implanted guard ring structure for backside illuminated image sensor Grant 8,531,565 - Wang , et al. September 10, 2	2013-09-10
CMOS image sensor and method for forming the same Grant 8,502,389 - Ho , et al. August 6, 2	2013-08-06
Multiple seal ring structure Grant 8,461,021 - Yaung , et al. June 11, 2	2013-06-11
Backside illumination sensor having a bonding pad structure and method of making the same Grant 8,435,824 - Tsai , et al. May 7, 2	2013-05-07
Multiple Seal Ring Structure App 20130109153 - Yaung; Dun-Nian ; et al.	2013-05-02
Seal Ring Structure With A Metal Pad App 20130082346 - Lin; Jeng-Shyan ; et al.	2013-04-04
Back side illuminated image sensor with improved stress immunity Grant 8,405,182 - Chou , et al. March 26, 2	2013-03-26
Light shield for CMOS imager Grant 8,383,440 - Wang , et al. February 26, 2	2013-02-26
CMOS Image Sensor and Method for Forming the Same App 20130037958 - Ho; Cheng-Ying ; et al.	2013-02-14
Pad Structures in BSI Image Sensor Chips App 20130032916 - Lin; Jeng-Shyan ; et al.	2013-02-07
Pad Structures Formed in Double Openings in Dielectric Layers App 20130032920 - Lin; Jeng-Shyan ; et al.	2013-02-07
Dual Metal For A Backside Package Of Backside Illuminated Image Sensor App 20130026467 - Chuang; Chun-Chieh ; et al.	2013-01-31
Novel Cmos Image Sensor Structure App 20130020662 - Kao; Min-Feng ; et al.	2013-01-24
Backside Illumination Sensor Having A Bonding Pad Structure And Method Of Making The Same App 20130009270 - Tsai; Shuang-Ji ; et al.	2013-01-10
Multiple seal ring structure Grant 8,338,917 - Yaung , et al. December 25, 2	2012-12-25
Semiconductor Device Having a Bonding Pad and Method of Manufacturing The Same App 20120292730 - Tsai; Shuang-Ji ; et al.	2012-11-22
Semiconductor Device Having a Bonding Pad and Shield Structure and Method of Manufacturing the Same App 20120292728 - Tsai; Shuang-Ji ; et al.	2012-11-22
Back Side Illuminated Image Sensor With Improved Stress Immunity App 20120280348 - CHOU; Keng-Yu ; et al.	2012-11-08
Image Sensor and Method of Fabricating Same App 20120273914 - Wang; Wen-De ; et al.	2012-11-01
Dual metal for a backside package of backside illuminated image sensor Grant 8,293,122 - Chuang , et al. October 23, 2	2012-10-23
Seal ring structure with metal pad Grant 8,283,754 - Lin , et al. October 9, 2	2012-10-09
Back Side Illuminated Image Sensor With Reduced Sidewall-induced Leakage App 20120205769 - Tsai; Shuang-Ji ; et al.	2012-08-16
Image sensor and method of fabricating same Grant 8,227,288 - Wang , et al. July 24, 2	2012-07-24
Method for generating two dimensions for different implant energies Grant 8,202,791 - Chuang , et al. June 19, 2	2012-06-19
Photodiode with multi-epi films for image sensor Grant 8,164,124 - Liu , et al. April 24, 2	2012-04-24
Seal Ring Structure With Metal Pad App 20120038020 - Lin; Jeng-Shyan ; et al.	2012-02-16
Multiple Seal Ring Structure App 20120038028 - Yaung; Dun-Nian ; et al.	2012-02-16
Ridge Structure For Back Side Illuminated Image Sensor App 20110298072 - Chuang; Chun-Chieh ; et al.	2011-12-08
Light Shield for CMOS Imager App 20110183460 - WANG; WEN-DE ; et al.	2011-07-28
Method of implantation Grant 7,968,424 - Lin , et al. June 28, 2	2011-06-28
Light shield for CMOS imager Grant 7,935,994 - Wang , et al. May 3, 2	2011-05-03
Backside Illuminated Image Sensor Having Capacitor On Pixel Region App 20110049589 - CHUANG; Chun-Chieh ; et al.	2011-03-03
Image Sensor And Method Of Fabricating Same App 20100244173 - Wang; Wen-De ; et al.	2010-09-30
Method And Apparatus Of Improving Efficiency Of An Image Sensor App 20100243868 - Liu; Han-Chi ; et al.	2010-09-30
Optical transmission improvement on multi-dielectric structure in advance CMOS imager Grant 7,803,647 - Wang , et al. September 28, 2	2010-09-28
Method For Generating Two Dimensions For Different Implant Energies App 20100233871 - Chuang; Chun-Chieh ; et al.	2010-09-16
Front Side Implanted Guard Ring Structure For Backside Illuminated Image Sensor App 20100220226 - WANG; Wen-De ; et al.	2010-09-02
Pad Design For Backside Illuminated Image Sensor App 20100213560 - Wang; Wen-De ; et al.	2010-08-26
Dual Metal For A Backside Package Of Backside Illuminated Image Sensor App 20100181283 - Chuang; Chun-Chieh ; et al.	2010-07-22
Method Of Implantation App 20100184242 - Lin; Jeng-Shyan ; et al.	2010-07-22
Isolation Structure For Image Sensor Device App 20080303932 - Wang; Wen-De ; et al.	2008-12-11
Photodiode With Multi-epi Films For Image Sensor App 20080246063 - Liu; Jen-Cheng ; et al.	2008-10-09
Optical Transmission Improvement On Multi-Dielectric Structure In Advance CMOS Imager App 20080191296 - Wang; Wen-De ; et al.	2008-08-14
CMOS image sensor Grant 7,253,458 - Hsu , et al. August 7, 2	2007-08-07
Light shield for CMOS imager App 20060186547 - Wang; Wen-De ; et al.	2006-08-24
Enhanced color image sensor device and method of making the same Grant 7,078,779 - Wang , et al. July 18, 2	2006-07-18
Enhanced color image sensor device and method of making the same App 20060081898 - Wang; Wen-De ; et al.	2006-04-20
CMOS image sensor App 20060054939 - Hsu; Tzu-Hsuan ; et al.	2006-03-16