Wang; Wen-chou V.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Wang; Wen-chou V..The latest application filed is for "multichip module substrate".
- Wang; Wen-chou V. - Cupertino CA
| Patent | Date |
|---|---|
| Multichip module substrate Grant 5,544,017 - Beilin , et al. August 6, 1 | 1996-08-06 |
| Apparatus for cooling semiconductor chips in multichip modules Grant 5,514,906 - Love , et al. May 7, 1 | 1996-05-07 |
| Functional substrates for packaging semiconductor chips Grant 5,475,262 - Wang , et al. December 12, 1 | 1995-12-12 |
| Process for fabricating a substrate with thin film capacitor and insulating plug Grant 5,455,064 - Chou , et al. October 3, 1 | 1995-10-03 |
| Through hole interconnect substrate fabrication process Grant 5,454,161 - Beilin , et al. October 3, 1 | 1995-10-03 |
| Three-dimensional multichip module Grant 5,426,563 - Moresco , et al. June 20, 1 | 1995-06-20 |
| Method for fabricating thin-film interconnector Grant 5,419,038 - Wang , et al. May 30, 1 | 1995-05-30 |
| Interconnect capacitors Grant 5,404,265 - Moresco , et al. April 4, 1 | 1995-04-04 |
| Functional substrates for packaging semiconductor chips Grant 5,382,827 - Wang , et al. January 17, 1 | 1995-01-17 |
| Method of curing thin films of organic dielectric material Grant 5,376,586 - Beilin , et al. December 27, 1 | 1994-12-27 |
| Process for fabricating a substrate with thin film capacitor Grant 5,323,520 - Peters , et al. June 28, 1 | 1994-06-28 |
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