Wang; Tung-Chuan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wang; Tung-Chuan.The latest application filed is for "chip package module with heat dissipation function and manufacturing method thereof".

Company Profile

1.6.15

Wang; Tung-Chuan - Taoyuan TW
WANG; TUNG-CHUAN - Taoyuan City TW
Wang; Tung-Chuan - Zhubie City TW
Wang; Tung-Chuan - Zhubie TW
Wang; Tung-Chuan - Hsinchu County TW
Wang; Tung-Chuan - Taoyuan County TW
Wang; Tung-Chuan - Yangmei Town TW
Wang, Tung-Chuan - Nan-Tou Hsien TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of fabricating a chip package module with improve heat dissipation effect Grant 11,145,565 - Yuan , et al. October 12, 2	2021-10-12
Chip Package Module With Heat Dissipation Function And Manufacturing Method Thereof App 20210043532 - YUAN; HSI-YING ; et al.	2021-02-11
Embedded Substrate Package Structure App 20180315712 - He; Sung-Lien ; et al.	2018-11-01
Embedded substrate package structure Grant 10,115,673 - He , et al. October 30, 2	2018-10-30
Planar Package Structure And Manufacturing Method Thereof App 20180166390 - Yu; Chao-Ching ; et al.	2018-06-14
Wafer level package with good CTE performance Grant 7,655,501 - Yang , et al. February 2, 2	2010-02-02
Semiconductor device package having multi-chips with side-by-side configuration and method of the same Grant 7,525,185 - Yang , et al. April 28, 2	2009-04-28
Image sensor module having build-in package cavity and the method of the same Grant 7,498,556 - Yang , et al. March 3, 2	2009-03-03
Semiconductor image device package with die receiving through-hole and method of the same Grant 7,459,729 - Yang , et al. December 2, 2	2008-12-02
Wafer level image sensor package with die receiving cavity and method of making the same App 20080274579 - Yang; Wen-Kun ; et al.	2008-11-06
Semiconductor Image Device Package With Die Receiving Through-hole And Method Of The Same App 20080261346 - Yang; Wen-Kun ; et al.	2008-10-23
Wafer Level Package With Good Cte Performance App 20080248614 - Yang; Wen-Kun ; et al.	2008-10-09
Semiconductor device package having multi-chips with side-by-side configuration and method of the same App 20080230884 - Yang; Wen-Kun ; et al.	2008-09-25
Image sensor module having build-in package cavity and the method of the same App 20080224248 - Yang; Wen-Kun ; et al.	2008-09-18
Semiconductor Device Package With Die Receiving Through-hole And Connecting Through-hole And Method Of The Same App 20080197478 - Yang; Wen-Kun ; et al.	2008-08-21
Wafer level image sensor package with die receiving cavity and method of making the same App 20080197435 - Yang; Wen-Kun ; et al.	2008-08-21
Image sensor package with die receiving opening and method of the same App 20080191333 - Yang; Wen-Kun ; et al.	2008-08-14
Image sensor module and the method of the same App 20080173792 - Yang; Wen-Kun ; et al.	2008-07-24
Semiconductor image device package with die receiving through-hole and method of the same App 20080157312 - Yang; Wen-Kun ; et al.	2008-07-03
Wafer Level Package With Good Cte Performance App 20080142946 - Yang; Wen-Kun ; et al.	2008-06-19
Optical storage medium of limiting play times App 20040037208 - Chen, Irene ; et al.	2004-02-26

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