Wang; Tong Hong
Patent Applications and Registrations
Patent applications and USPTO patent grants for Wang; Tong Hong.The latest application filed is for "semiconductor package using an active type heat-spreading element".
- Wang; Tong Hong - Selangor D.E MY
- WANG; Tong Hong - BANTING MY
- Wang; Tong-hong - Kaohsiung City TW
| Patent | Date |
|---|---|
| Semiconductor package using an active type heat-spreading element Grant 8,022,534 - Wang , et al. September 20, 2 | 2011-09-20 |
| Semiconductor Package Using An Active Type Heat-spreading Element App 20090250806 - WANG; Tong Hong ; et al. | 2009-10-08 |
| Heat Sink Structure And Semiconductor Package As Well As Method For Configuring Heat Sinks On A Semiconductor Package App 20090230544 - WANG; Tong Hong ; et al. | 2009-09-17 |
| Chip packaging process Grant 7,482,204 - Kao , et al. January 27, 2 | 2009-01-27 |
| Chip Package Structure App 20080272486 - Wang; Wei-Chung ; et al. | 2008-11-06 |
| Chip Packaging Process App 20080096325 - Kao; Chin-Li ; et al. | 2008-04-24 |
| Chip package structure and chip packaging process Grant 7,335,982 - Kao , et al. February 26, 2 | 2008-02-26 |
| Reinforced Semiconductor Package And Stiffener Thereof App 20080042263 - Wang; Tong-hong ; et al. | 2008-02-21 |
| Heat dissipation apparatus for package device Grant 7,259,456 - Wang August 21, 2 | 2007-08-21 |
| Chip Structure And Chip Manufacturing Process App 20070145604 - Kao; Chin-Li ; et al. | 2007-06-28 |
| Heat Sink And Package Structure App 20060197219 - Lee; Chang-Chi ; et al. | 2006-09-07 |
| Asymmetric bump structure App 20050263883 - Wang, Tong-Hong ; et al. | 2005-12-01 |
| Chip Package Structure And Chip Packaging Process App 20050224956 - Kao, Chin-Li ; et al. | 2005-10-13 |
| Heat dissipation apparatus for package device App 20050040520 - Wang, Tong-Hong | 2005-02-24 |
| Bump structure of a semiconductor wafer and manufacturing method thereof App 20040266066 - Wang, Tong Hong | 2004-12-30 |
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