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Optical sensor packaging system
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Feature Removal Framework To Streamline Machine Learning
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Giant six-legged polar research vehicle with tracked feet
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Optical Sensor Packaging System
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Optical sensor packaging system
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Giant Six-legged Polar Researchvehicle With Tracked Feet
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Giant Gully-crossing Vehicles For Polar Scientific Expedition
App 20200208359 - ZHAO; Fuqiang ; et al. | 2020-07-02 |
Optical Sensor Packaging System
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Semiconductor laser
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Method Of Restoring Bright Dot Of Organic Electroluminescent Device, Organic Electroluminescent Device And Manufacturing Method Thereof, And Display Apparatus
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A Semiconductor Laser
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Stacked wafer-level package device
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Laterally aligned colloidal nanorods assemblies
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Fuel cell system with wetness sensor
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Enhanced WLP for superior temp cycling, drop test and high current applications
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Laterally Aligned Colloidal Nanorods Assemblies
App 20140319563 - Cao; Yunwei Charles ; et al. | 2014-10-30 |
Stacked Wafer-level Package Device
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Enhanced Wlp For Superior Temp Cycling, Drop Test And High Current Applications
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System and method for hydrating a proton exchange membrane fuel cell
Grant 8,273,501 - Wang , et al. September 25, 2 | 2012-09-25 |
Enhanced WLP for superior temp cycling, drop test and high current applications
Grant 8,264,089 - Alvarado , et al. September 11, 2 | 2012-09-11 |
Enhanced Wlp For Superior Temp Cycling, Drop Test And High Current Applications
App 20110227219 - ALVARADO; REY ; et al. | 2011-09-22 |
Fuel Cell System With Wetness Sensor
App 20110033764 - Wang; Tie ; et al. | 2011-02-10 |
System And Method For Hydrating A Proton Exchange Membrane Fuel Cell
App 20110027669 - Wang; Tie ; et al. | 2011-02-03 |
Strip-fabricated flip chip in package and flip chip in system heat spreader assemblies and fabrication methods therefor
Grant 7,153,725 - Wang , et al. December 26, 2 | 2006-12-26 |
Method for fabricating a flip chip package with pillar bump and no flow underfill
Grant 7,087,458 - Wang , et al. August 8, 2 | 2006-08-08 |
Strip-fabricated flip chip in package and flip chip in system heat spreader assemblies and fabrication methods therefor
App 20050161780 - Wang, Tie ; et al. | 2005-07-28 |
Method for fabricating a flip chip package with pillar bump and no flow underfill
App 20040087057 - Wang, Tie ; et al. | 2004-05-06 |
Plant glutamine:fructose-6-phosphate amidotransferase nucleic acids
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Method for producing a flip chip package
Grant 6,365,435 - Wang , et al. April 2, 2 | 2002-04-02 |
Electrical and chemical treatment of an oxygen sensor
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