WANG; Sung-Fei
Patent Applications and Registrations
Patent applications and USPTO patent grants for WANG; Sung-Fei.The latest application filed is for "device for a multi-boot system with network switches".
- WANG; Sung-Fei - Tainan City TW
- Wang; Sung-Fei - Kaohsiung TW
- Wang, Sung-Fei - Nantz Chiu TW
- Wang, Sung-Fei - Nantze Kaohsiung TW
| Patent | Date |
|---|---|
| Device For A Multi-boot System With Network Switches App 20120210035 - HIR; Way-Dir ; et al. | 2012-08-16 |
| Flip-chip package Grant 7,473,989 - Yang , et al. January 6, 2 | 2009-01-06 |
| Package structure and heat sink module thereof App 20080036077 - Wang; Sung-Fei | 2008-02-14 |
| Flip chip stacked package Grant 7,291,924 - Wang , et al. November 6, 2 | 2007-11-06 |
| Multi-chips stacked package Grant 7,268,418 - Wang September 11, 2 | 2007-09-11 |
| Multi-chips stacked package App 20070176278 - Wang; Sung-Fei | 2007-08-02 |
| Package structure and manufacturing method thereof App 20070152330 - Wang; Sung-Fei | 2007-07-05 |
| Multi-chips stacked package Grant 7,215,016 - Wang May 8, 2 | 2007-05-08 |
| Semiconductor package with a heat spreader Grant 7,026,719 - Wang April 11, 2 | 2006-04-11 |
| Heat sink for chip package and bonding method thereof Grant 7,025,848 - Wang April 11, 2 | 2006-04-11 |
| Stacked semiconductor chip package Grant 7,023,079 - Wang , et al. April 4, 2 | 2006-04-04 |
| Flip chip package capable of measuring bond line thickness of thermal interface material Grant 7,015,577 - Wang March 21, 2 | 2006-03-21 |
| Multi-chips stacked package Grant 7,002,255 - Wang February 21, 2 | 2006-02-21 |
| Flip Chip Package Capable Of Measuring Bond Line Thickness Of Thermal Interface Material App 20060017155 - Wang; Sung-Fei | 2006-01-26 |
| High density semiconductor package Grant 6,949,826 - Wang September 27, 2 | 2005-09-27 |
| Thermal enhance MCM package Grant 6,936,930 - Wang August 30, 2 | 2005-08-30 |
| Multi-chips package Grant 6,879,031 - Wang April 12, 2 | 2005-04-12 |
| Flip-chip package App 20050046039 - Yang, Chaur-Chin ; et al. | 2005-03-03 |
| Flip chip stacked package App 20050046040 - Wang, Sung-Fei ; et al. | 2005-03-03 |
| Multi-chip stack flip-chip package Grant 6,861,761 - Yang , et al. March 1, 2 | 2005-03-01 |
| Flip chip package with reinforced bumps App 20040227252 - Wang, Sung-Fei | 2004-11-18 |
| Multi-chips stacked package App 20040212064 - Wang, Sung-Fei | 2004-10-28 |
| Multi-chips stacked package App 20040212066 - Wang, Sung-Fei | 2004-10-28 |
| Multi-chips stacked package App 20040212096 - Wang, Sung-Fei | 2004-10-28 |
| Multi-chips package App 20040212065 - Wang, Sung-Fei | 2004-10-28 |
| Multi-chips module package App 20040188818 - Wang, Sung-Fei | 2004-09-30 |
| Multi-chips stacked package App 20040183190 - Wang, Sung-Fei | 2004-09-23 |
| Multi-chips stacked package App 20040183180 - Chung, Chih-Ming ; et al. | 2004-09-23 |
| Multi-chips stacked package App 20040184250 - Wang, Sung-Fei | 2004-09-23 |
| Thin type ball grid array package App 20040173903 - Yang, Chaur-Chin ; et al. | 2004-09-09 |
| [semiconductor Package With A Heat Spreader] App 20040164390 - Wang, Sung-Fei | 2004-08-26 |
| Thermal enhance MCM package App 20040150116 - Wang, Sung-Fei | 2004-08-05 |
| Multi-chip stack flip-chip package App 20040124539 - Yang, Chaur-Chin ; et al. | 2004-07-01 |
| [heat Sink For Chip Package And Bonding Method Thereof] App 20040118500 - Wang, Sung-Fei | 2004-06-24 |
| [high Density Semiconductor Package] App 20040104475 - Wang, Sung-Fei | 2004-06-03 |
| Multichip module App 20020140073 - Pai, Tsung Ming ; et al. | 2002-10-03 |
| Stacked semiconductor chip package App 20020125580 - Wang, Sung-Fei ; et al. | 2002-09-12 |
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