Wang; Shi ping

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wang; Shi ping.The latest application filed is for "sterilization and deodorization waste bin with dual-band ultraviolet tube".

Company Profile

0.7.9

Wang; Shi ping - PINGTAN Fujian CN
Wang; Shi-Ping - Fremont CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Sterilization and Deodorization Waste Bin with Dual-band Ultraviolet Tube App 20220258968 - Wang; Shi ping ; et al.	2022-08-18
Grooved retaining ring Grant 7,520,795 - Wang , et al. April 21, 2	2009-04-21
System And Method For In-situ Head Rinse App 20080003931 - Manens; Antoine P. ; et al.	2008-01-03
Method of chemical mechanical polishing with high throughput and low dishing Grant 7,232,761 - Li , et al. June 19, 2	2007-06-19
Grooved Retaining Ring App 20070044913 - Wang; Shi-Ping ; et al.	2007-03-01
Metal CMP process on one or more polishing stations using slurries with oxidizers App 20060219663 - Wang; Shi-Ping ; et al.	2006-10-05
Method and apparatus for polishing metal and dielectric substrates Grant 6,960,521 - Moon , et al. November 1, 2	2005-11-01
Method and apparatus for polishing metal and dielectric substrates App 20050032381 - Moon, Yongsik ; et al.	2005-02-10
Method of chemical mechanical polishing with high throughput and low dishing App 20050026442 - Li, Shijian ; et al.	2005-02-03
Methods and apparatus for polishing substrates comprising conductive and dielectric materials with reduced topographical defects Grant 6,790,768 - Moon , et al. September 14, 2	2004-09-14
Method of chemical mechanical polishing with high throughput and low dishing Grant 6,780,773 - Li , et al. August 24, 2	2004-08-24
Pad cleaning for a CMP system Grant 6,669,538 - Li , et al. December 30, 2	2003-12-30
Platen for retaining polishing material Grant 6,592,439 - Li , et al. July 15, 2	2003-07-15
Method and apparatus for polishing metal and dielectric substrates App 20030029841 - Moon, Yongsik ; et al.	2003-02-13
Method of chemical mechanical polishing with high throughput and low dishing App 20030022497 - Li, Shijian ; et al.	2003-01-30
Pad Cleaning for a CMP system App 20020090896 - Li, Shijian ; et al.	2002-07-11

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