loadpatents
name:-0.0095767974853516
name:-0.0096380710601807
name:-0.00038909912109375
Wang; Shenghua Patent Filings

Wang; Shenghua

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wang; Shenghua.The latest application filed is for "soybean milk machine of rapid pulping".

Company Profile
0.9.9
  • Wang; Shenghua - Xiamen N/A CN
  • Wang; Shenghua - Shandong CN
  • Wang; Shenghua - Shenzhen CN
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semi-solid metal in-cavity molding die
Grant 10,821,503 - Wang November 3, 2
2020-11-03
Soybean Milk Machine Of Rapid Pulping
App 20160374514 - Wang; Xuning ;   et al.
2016-12-29
Soybean Milk Machine Of Rapid Pulping
App 20130081544 - Wang; Xuning ;   et al.
2013-04-04
Heat pipe incorporating outer and inner pipes
Grant 7,543,630 - Lai , et al. June 9, 2
2009-06-09
Heat pipe incorporating outer and inner pipes
Grant 7,484,553 - Lai , et al. February 3, 2
2009-02-03
Liquid-cooled heat sink assembly
Grant 7,224,585 - Lee , et al. May 29, 2
2007-05-29
Heat pipe incorporating outer and inner pipes
App 20060201656 - Lai; Cheng-Tien ;   et al.
2006-09-14
Liquid-cooled heat sink assembly
App 20050024830 - Lee, Tsung Lung ;   et al.
2005-02-03
Heat dissipation device with working liquid received in circulatory route
Grant 6,808,013 - Lai , et al. October 26, 2
2004-10-26
Fan holder for heat sink
Grant 6,788,536 - Lai , et al. September 7, 2
2004-09-07
Fan holder for heat sink
App 20040008488 - Lai, Cheng-Tien ;   et al.
2004-01-15
Heat dissipation device
Grant 6,650,543 - Lai , et al. November 18, 2
2003-11-18
Mounting assembly for heat sink
Grant 6,646,881 - Lai , et al. November 11, 2
2003-11-11
Heat pipe incorporating outer and inner pipes
App 20030183372 - Lai, Cheng-Tien ;   et al.
2003-10-02
Heat dissipation device with working liquid received in circulatory route
App 20030173061 - Lai, Cheng-Tien ;   et al.
2003-09-18
Heat dissipation device
App 20030151897 - Lai, Cheng-Tien ;   et al.
2003-08-14

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