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Patent applications and USPTO patent grants for Wang; Shenghua.The latest application filed is for "soybean milk machine of rapid pulping".
Patent | Date |
---|---|
Semi-solid metal in-cavity molding die Grant 10,821,503 - Wang November 3, 2 | 2020-11-03 |
Soybean Milk Machine Of Rapid Pulping App 20160374514 - Wang; Xuning ;   et al. | 2016-12-29 |
Soybean Milk Machine Of Rapid Pulping App 20130081544 - Wang; Xuning ;   et al. | 2013-04-04 |
Heat pipe incorporating outer and inner pipes Grant 7,543,630 - Lai , et al. June 9, 2 | 2009-06-09 |
Heat pipe incorporating outer and inner pipes Grant 7,484,553 - Lai , et al. February 3, 2 | 2009-02-03 |
Liquid-cooled heat sink assembly Grant 7,224,585 - Lee , et al. May 29, 2 | 2007-05-29 |
Heat pipe incorporating outer and inner pipes App 20060201656 - Lai; Cheng-Tien ;   et al. | 2006-09-14 |
Liquid-cooled heat sink assembly App 20050024830 - Lee, Tsung Lung ;   et al. | 2005-02-03 |
Heat dissipation device with working liquid received in circulatory route Grant 6,808,013 - Lai , et al. October 26, 2 | 2004-10-26 |
Fan holder for heat sink Grant 6,788,536 - Lai , et al. September 7, 2 | 2004-09-07 |
Fan holder for heat sink App 20040008488 - Lai, Cheng-Tien ;   et al. | 2004-01-15 |
Heat dissipation device Grant 6,650,543 - Lai , et al. November 18, 2 | 2003-11-18 |
Mounting assembly for heat sink Grant 6,646,881 - Lai , et al. November 11, 2 | 2003-11-11 |
Heat pipe incorporating outer and inner pipes App 20030183372 - Lai, Cheng-Tien ;   et al. | 2003-10-02 |
Heat dissipation device with working liquid received in circulatory route App 20030173061 - Lai, Cheng-Tien ;   et al. | 2003-09-18 |
Heat dissipation device App 20030151897 - Lai, Cheng-Tien ;   et al. | 2003-08-14 |
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