loadpatents
Patent applications and USPTO patent grants for Wang; Shaw-Fuu.The latest application filed is for "heat dissipating module".
Patent | Date |
---|---|
Heat sink structure Grant 7,946,336 - Wang , et al. May 24, 2 | 2011-05-24 |
Electronic device and heat sink thereof Grant 7,940,528 - Wang , et al. May 10, 2 | 2011-05-10 |
Heat dissipating module Grant 7,835,152 - Wang , et al. November 16, 2 | 2010-11-16 |
Heat dissipation device Grant 7,826,227 - Wang , et al. November 2, 2 | 2010-11-02 |
Heat dissipation module Grant 7,775,778 - Wang , et al. August 17, 2 | 2010-08-17 |
Heat Dissipating Module App 20100124026 - Wang; Shaw-Fuu ;   et al. | 2010-05-20 |
Electronic Device And Heat Sink Thereof App 20100053892 - WANG; Feng-Ku ;   et al. | 2010-03-04 |
Loop Heat Pipe App 20090321055 - WANG; FENG-KU ;   et al. | 2009-12-31 |
Swing type fan Grant 7,621,725 - Huang , et al. November 24, 2 | 2009-11-24 |
Heat dissipation device Grant 7,619,894 - Wang , et al. November 17, 2 | 2009-11-17 |
Method For Updating Electronic Dictionary App 20090241102 - Wang; Shaw-Fuu | 2009-09-24 |
Heat sink structure App 20090211729 - Wang; Feng-Ku ;   et al. | 2009-08-27 |
Heat Dissipation Device App 20090213555 - WANG; Shaw-Fuu ;   et al. | 2009-08-27 |
Heat dissipation device App 20090201647 - Wang; Feng-Ku ;   et al. | 2009-08-13 |
Swing Type Fan App 20090047152 - Huang; Ting-Chiang ;   et al. | 2009-02-19 |
Heat Dissipation Module App 20090004963 - Wang; Shaw-Fuu ;   et al. | 2009-01-01 |
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