Wang; Rung-De
Patent Applications and Registrations
Patent applications and USPTO patent grants for Wang; Rung-De.The latest application filed is for "semiconductor structure".
- Wang; Rung-De - Kaohsiung City TW
- Wang; Rung-De - Kaohsiung TW
| Patent | Date |
|---|---|
| Semiconductor Structure App 20220254737 - Wang; Rung-De ; et al. | 2022-08-11 |
| Semiconductor structure Grant 11,348,879 - Wang , et al. May 31, 2 | 2022-05-31 |
| Semiconductor Structure App 20210013159 - Wang; Rung-De ; et al. | 2021-01-14 |
| Manufacturing method of semiconductor structure Grant 10,818,612 - Wang , et al. October 27, 2 | 2020-10-27 |
| Manufacturing Method Of Semiconductor Structure App 20190371741 - Wang; Rung-De ; et al. | 2019-12-05 |
| Semiconductor Structure And Manufacturing Method Thereof App 20190131251 - Wang; Rung-De ; et al. | 2019-05-02 |
| Semiconductor structure and manufacturing method thereof Grant 10,276,514 - Wang , et al. | 2019-04-30 |
| Semicondcutor structure and semiconductor manufacturing process thereof Grant 9,837,366 - Liu , et al. December 5, 2 | 2017-12-05 |
| Improving the strength of micro-bump joints Grant 9,768,138 - Shen , et al. September 19, 2 | 2017-09-19 |
| Improving the Strength of Micro-Bump Joints App 20160104685 - Shen; Wen-Wei ; et al. | 2016-04-14 |
| Strength of micro-bump joints Grant 9,219,046 - Shen , et al. December 22, 2 | 2015-12-22 |
| Strength of Micro-Bump Joints App 20150037936 - Shen; Wen-Wei ; et al. | 2015-02-05 |
| Strength of micro-bump joints Grant 8,901,736 - Shen , et al. December 2, 2 | 2014-12-02 |
| Strength of Micro-Bump Joints App 20110291262 - Shen; Wen-Wei ; et al. | 2011-12-01 |
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