WANG; Peichun
Patent Applications and Registrations
Patent applications and USPTO patent grants for WANG; Peichun.The latest application filed is for "package substrate structure and method for manufacturing same".
- WANG; Peichun - Shanghai CN
- Wang; Peichun - Suzhou CN
| Patent | Date |
|---|---|
| Package Substrate Structure And Method For Manufacturing Same App 20220301888 - MEI; Meng ; et al. | 2022-09-22 |
| Method for testing electrical performance of packaged chip Grant 11,393,732 - Mei , et al. July 19, 2 | 2022-07-19 |
| Method For Testing Electrical Performance Of Packaged Chip App 20220148932 - MEI; Meng ; et al. | 2022-05-12 |
| Package Substrate And Manufacturing Method Thereof App 20220141962 - MEI; Meng ; et al. | 2022-05-05 |
| Laminate structure and test method for detecting inter-metal dielectric layer defects Grant 11,270,918 - Zhang , et al. March 8, 2 | 2022-03-08 |
| Laminate Structure And Test Method For Detecting Inter-metal Dielectric Layer Defects App 20190371685 - ZHANG; Xiong ; et al. | 2019-12-05 |
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