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Wang; Pai-Wei Patent Filings

Wang; Pai-Wei

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wang; Pai-Wei.The latest application filed is for "multiple patterning method for semiconductor devices".

Company Profile
2.3.3
  • Wang; Pai-Wei - Hsin-Chu TW
  • Wang; Pai-Wei - Taoyuan TW
  • WANG; Pai-Wei - Taoyuan City TW
  • Wang; Pai-Wei - Taoyuan County TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Multiple patterning method for semiconductor devices
Grant 10,817,635 - Hsieh , et al. October 27, 2
2020-10-27
Multiple patterning decomposition and manufacturing methods for IC
Grant 10,274,829 - Hsieh , et al.
2019-04-30
Multiple Patterning Method for Semiconductor Devices
App 20190042685 - Hsieh; Ken-Hsien ;   et al.
2019-02-07
Multiple Patterning Decomposition And Manufacturing Methods For Ic
App 20180164695 - HSIEH; Ken-Hsien ;   et al.
2018-06-14
Method and network system of converting a layer two network from a spanning tree protocol mode to a routed mesh mode without a spanning tree protocol
Grant 9,231,831 - Chiueh , et al. January 5, 2
2016-01-05
Method Of Converting Routing Mode Of Network, Central Controller And Data Center Network System Using The Method
App 20140133360 - Chiueh; Tzi-Cker ;   et al.
2014-05-15

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