| Patent | Date |
|---|
Dmos Fet Chip Scale Package And Method Of Making The Same
App 20220278009 - Xue; Yan Xun ; et al. | 2022-09-01 |
Wafer Level Chip Scale Semiconductor Package
App 20220278076 - Xue; Yan Xun ; et al. | 2022-09-01 |
Method for semi-wafer level packaging
Grant 11,430,762 - Xue , et al. August 30, 2 | 2022-08-30 |
Method For Semi-wafer Level Packaging
App 20220208724 - Xue; Yan Xun ; et al. | 2022-06-30 |
Semiconductor Package Having Wettable Lead Flank And Method Of Making The Same
App 20220199425 - Xue; Yan Xun ; et al. | 2022-06-23 |
Power semiconductor package having integrated inductor, resistor and capacitor
Grant 11,309,233 - Zhang , et al. April 19, 2 | 2022-04-19 |
Super-fast transient response (STR) AC/DC converter for high power density charging application
Grant 11,258,270 - Huang , et al. February 22, 2 | 2022-02-22 |
Semiconductor package having enlarged gate pad and method of making the same
Grant 11,222,858 - Xue , et al. January 11, 2 | 2022-01-11 |
Semiconductor Package Having Enlarged Gate Pad And Method Of Making The Same
App 20210398926 - Xue; Yan Xun ; et al. | 2021-12-23 |
Method of making reverse conducting insulated gate bipolar transistor
Grant 11,101,137 - Niu , et al. August 24, 2 | 2021-08-24 |
Semiconductor package and method of making the same
Grant 11,069,604 - Zhang , et al. July 20, 2 | 2021-07-20 |
Power Module Having Interconnected Base Plate With Molded Metal And Method Of Making The Same
App 20210175155 - Niu; Zhiqiang ; et al. | 2021-06-10 |
Semiconductor Package Having Thin Substrate And Method Of Making The Same
App 20210125940 - Lu; Jun ; et al. | 2021-04-29 |
Common source land grid array package
Grant 10,991,680 - Xue , et al. April 27, 2 | 2021-04-27 |
Semiconductor package having high mechanical strength
Grant 10,991,660 - Wang , et al. April 27, 2 | 2021-04-27 |
Common Source Land Grid Array Package
App 20210083088 - Xue; Yan Xun ; et al. | 2021-03-18 |
Power Semiconductor Package Having Integrated Inductor And Method Of Making The Same
App 20210082790 - Zhang; Xiaotian ; et al. | 2021-03-18 |
Power Semiconductor Package Having Integrated Inductor, Resistor And Capacitor
App 20210082793 - Zhang; Xiaotian ; et al. | 2021-03-18 |
Super-fast Transient Response (str) Ac/dc Converter For High Power Density Charging Application
App 20200412148 - Huang; Pei-Lun ; et al. | 2020-12-31 |
Super-fast transient response (STR) AC/DC converter for high power density charging application
Grant 10,818,568 - Huang , et al. October 27, 2 | 2020-10-27 |
Semiconductor Package And Method Of Making The Same
App 20200194347 - Xue; Yan Xun ; et al. | 2020-06-18 |
Semiconductor Package And Method Of Making The Same
App 20200194395 - Zhang; Xiaotian ; et al. | 2020-06-18 |
Super-fast transient response (STR) AC/DC Converter for high power density charging application
Grant 10,630,080 - Huang , et al. | 2020-04-21 |
Packaging arrangements including high density interconnect bridge
Grant 10,438,881 - Wang , et al. O | 2019-10-08 |
Methods and apparatus for self-alignment of integrated circuit dies
Grant 10,431,515 - Wang , et al. O | 2019-10-01 |
Semiconductor Package Having High Mechanical Strength
App 20190189569 - Wang; Long-Ching ; et al. | 2019-06-20 |
Method and apparatus for interconnecting stacked dies using metal posts
Grant 9,972,602 - Wang May 15, 2 | 2018-05-15 |
Methods and Apparatus for Self-Alignment of Integrated Circuit Dies
App 20180068921 - Wang; Long-Ching ; et al. | 2018-03-08 |
Method and apparatus for improving the reliability of a connection to a via in a substrate
Grant 9,659,851 - Wang , et al. May 23, 2 | 2017-05-23 |
Packaging Arrangements Including High Density Interconnect Bridge
App 20170125334 - Wang; Long-Ching ; et al. | 2017-05-04 |
Method and apparatus for incorporating passive devices in an integrated passive device separate from a die
Grant 9,444,510 - Leong , et al. September 13, 2 | 2016-09-13 |
Method And Apparatus For Interconnecting Stacked Dies Using Metal Posts
App 20160247784 - Wang; Long-Ching | 2016-08-25 |
Method And Apparatus For Incorporating Passive Devices In An Integrated Passive Device Separate From A Die
App 20150244410 - Leong; Poh Boon ; et al. | 2015-08-27 |
Method And Apparatus For Improving The Reliability Of A Connection To A Via In A Substrate
App 20150228569 - Wang; Long-Ching ; et al. | 2015-08-13 |
Direction interactive member of a wrench
Grant D727,120 - Wang April 21, 2 | 2015-04-21 |
Passive elements, articles, packages, semiconductor composites, and methods of manufacturing same
Grant 8,846,538 - Chen , et al. September 30, 2 | 2014-09-30 |
Panel based lead frame packaging method and device
Grant 8,435,837 - Tsai , et al. May 7, 2 | 2013-05-07 |
Passive elements, articles, packages, semiconductor composites, and methods of manufacturing same
Grant 8,258,065 - Chen , et al. September 4, 2 | 2012-09-04 |
Panel Based Lead Frame Packaging Method And Device
App 20110140254 - Tsai; Chen Lung ; et al. | 2011-06-16 |
Passive Elements, Articles, Packages, Semiconductor Composites, And Methods Of Manufacturing Same
App 20100173468 - CHEN; Bomy ; et al. | 2010-07-08 |
Passive elements, articles, packages, semiconductor composites, and methods of manufacturing same
Grant 7,605,092 - Chen , et al. October 20, 2 | 2009-10-20 |
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