WANG; Lejun

Patent Applications and Registrations

Patent applications and USPTO patent grants for WANG; Lejun.The latest application filed is for "method and device for directly preparing foamed polylactic acid (pla) product from pla melt".

Company Profile

3.15.24

WANG; Lejun - Beijing CN
Wang; Lejun - Chandler AZ US
Wang; Lejun - San Diego CA
Wang; Lejun - Shandong CN
Wang, Lejun - Atlanta GA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method And Device For Directly Preparing Foamed Polylactic Acid (pla) Product From Pla Melt App 20220097274 - SONG; Yanan ; et al.	2022-03-31
Preparation Method Of High-rate Foamed Polylactic Acid (pla) Sheet App 20220088840 - HUANG; Weiwei ; et al.	2022-03-24
Wafer level packages of high voltage units for implantable medical devices Grant 11,213,690 - Boone , et al. January 4, 2	2022-01-04
Implantable Medical Device Including A Molded Planar Transformer App 20200352508 - Boone; Mark R. ; et al.	2020-11-12
Polishing Liquid For Cmp And Preparation Method And Use Thereof App 20190185715 - Wang; Lejun ; et al.	2019-06-20
Implantable Medical Device Including A Molded Planar Transformer App 20170086740 - Boone; Mark R. ; et al.	2017-03-30
Implantable medical device including a molded planar transformer Grant 9,607,759 - Boone , et al. March 28, 2	2017-03-28
Integrated circuit packaging for implantable medical devices Grant 9,496,241 - Askarinya , et al. November 15, 2	2016-11-15
Integrated Circuit Packaging For Implantable Medical Devices App 20140368266 - Askarinya; Mohsen ; et al.	2014-12-18
Implantable Medical Device Including A Molded Planar Transformer App 20140277223 - Boone; Mark R. ; et al.	2014-09-18
Implantable Medical Device Including A Molded Planar Transformer App 20140275915 - Boone; Mark R. ; et al.	2014-09-18
Integrated circuit packaging for implantable medical devices Grant 8,824,161 - Askarinya , et al. September 2, 2	2014-09-02
Implantable medical device having a multi-axis magnetic sensor Grant 8,750,961 - Ries , et al. June 10, 2	2014-06-10
Integrated Circuit Packaging For Implantable Medical Devices App 20130335937 - Askarinya; Mohsen ; et al.	2013-12-19
Wafer Level Packages Of High Voltage Units For Implantable Medical Devices And Corresponding Fabrication Methods App 20130334680 - Boone; Mark R. ; et al.	2013-12-19
Fire retardant antiflux fiber and its production process Grant 8,133,583 - Tian , et al. March 13, 2	2012-03-13
Fire Retardant Antiflux Fiber And Its Production Process App 20100019213 - Tian; Sufeng ; et al.	2010-01-28
Local control of underfill flow on high density packages, packages and systems made therewith, and methods of making same App 20080150099 - Landeros; Juan ; et al.	2008-06-26
Local control of underfill flow on high density packages, packages and systems made therewith, and methods of making same Grant 7,359,211 - Landeros , et al. April 15, 2	2008-04-15
Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material App 20070117263 - Shi; Song-Hua ; et al.	2007-05-24
Self-aligned mechanical joint between die and substrate exposed to mixed microwave energy Grant 7,199,342 - Ratificar , et al. April 3, 2	2007-04-03
Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material Grant 7,179,684 - Shi , et al. February 20, 2	2007-02-20
Local control of underfill flow on high density packages, packages and systems made therewith, and methods of making same App 20050195582 - Landeros, Juan ; et al.	2005-09-08
Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material App 20050196906 - Shi, Song-Hua ; et al.	2005-09-08
Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material Grant 6,899,960 - Shi , et al. May 31, 2	2005-05-31
Polybenzoxazine based wafer-level underfill material Grant 6,730,542 - Wang , et al. May 4, 2	2004-05-04
Polybenzoxazine based wafer-level underfill material Grant 6,727,594 - Wang , et al. April 27, 2	2004-04-27
Solder reflow with microwave energy App 20040016752 - Ratificar, Glenn ; et al.	2004-01-29
Solder reflow with microwave energy Grant 6,644,536 - Ratificar , et al. November 11, 2	2003-11-11
Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material App 20030190477 - Shi, Song-Hua ; et al.	2003-10-09
Polybenzoxazine based wafer-level underfill material App 20030137043 - Wang, Lejun ; et al.	2003-07-24
Solder reflow with microwave energy App 20030121958 - Ratificar, Glenn ; et al.	2003-07-03
Polybenzoxazine based wafer-level underfill material App 20030122241 - Wang, Lejun ; et al.	2003-07-03
No-flow reworkable epoxy underfills for flip-chip applications App 20020035201 - Wang, Lejun ; et al.	2002-03-21
Thermally degradable epoxy underfills for flip-chip applications App 20020013420 - Wang, Lejun ; et al.	2002-01-31

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