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Method And Device For Directly Preparing Foamed Polylactic Acid (pla) Product From Pla Melt App 20220097274 - SONG; Yanan ;   et al. | 2022-03-31 |
Preparation Method Of High-rate Foamed Polylactic Acid (pla) Sheet App 20220088840 - HUANG; Weiwei ;   et al. | 2022-03-24 |
Wafer level packages of high voltage units for implantable medical devices Grant 11,213,690 - Boone , et al. January 4, 2 | 2022-01-04 |
Implantable Medical Device Including A Molded Planar Transformer App 20200352508 - Boone; Mark R. ;   et al. | 2020-11-12 |
Polishing Liquid For Cmp And Preparation Method And Use Thereof App 20190185715 - Wang; Lejun ;   et al. | 2019-06-20 |
Implantable Medical Device Including A Molded Planar Transformer App 20170086740 - Boone; Mark R. ;   et al. | 2017-03-30 |
Implantable medical device including a molded planar transformer Grant 9,607,759 - Boone , et al. March 28, 2 | 2017-03-28 |
Integrated circuit packaging for implantable medical devices Grant 9,496,241 - Askarinya , et al. November 15, 2 | 2016-11-15 |
Integrated Circuit Packaging For Implantable Medical Devices App 20140368266 - Askarinya; Mohsen ;   et al. | 2014-12-18 |
Implantable Medical Device Including A Molded Planar Transformer App 20140277223 - Boone; Mark R. ;   et al. | 2014-09-18 |
Implantable Medical Device Including A Molded Planar Transformer App 20140275915 - Boone; Mark R. ;   et al. | 2014-09-18 |
Integrated circuit packaging for implantable medical devices Grant 8,824,161 - Askarinya , et al. September 2, 2 | 2014-09-02 |
Implantable medical device having a multi-axis magnetic sensor Grant 8,750,961 - Ries , et al. June 10, 2 | 2014-06-10 |
Integrated Circuit Packaging For Implantable Medical Devices App 20130335937 - Askarinya; Mohsen ;   et al. | 2013-12-19 |
Wafer Level Packages Of High Voltage Units For Implantable Medical Devices And Corresponding Fabrication Methods App 20130334680 - Boone; Mark R. ;   et al. | 2013-12-19 |
Fire retardant antiflux fiber and its production process Grant 8,133,583 - Tian , et al. March 13, 2 | 2012-03-13 |
Fire Retardant Antiflux Fiber And Its Production Process App 20100019213 - Tian; Sufeng ;   et al. | 2010-01-28 |
Local control of underfill flow on high density packages, packages and systems made therewith, and methods of making same App 20080150099 - Landeros; Juan ;   et al. | 2008-06-26 |
Local control of underfill flow on high density packages, packages and systems made therewith, and methods of making same Grant 7,359,211 - Landeros , et al. April 15, 2 | 2008-04-15 |
Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material App 20070117263 - Shi; Song-Hua ;   et al. | 2007-05-24 |
Self-aligned mechanical joint between die and substrate exposed to mixed microwave energy Grant 7,199,342 - Ratificar , et al. April 3, 2 | 2007-04-03 |
Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material Grant 7,179,684 - Shi , et al. February 20, 2 | 2007-02-20 |
Local control of underfill flow on high density packages, packages and systems made therewith, and methods of making same App 20050195582 - Landeros, Juan ;   et al. | 2005-09-08 |
Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material App 20050196906 - Shi, Song-Hua ;   et al. | 2005-09-08 |
Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material Grant 6,899,960 - Shi , et al. May 31, 2 | 2005-05-31 |
Polybenzoxazine based wafer-level underfill material Grant 6,730,542 - Wang , et al. May 4, 2 | 2004-05-04 |
Polybenzoxazine based wafer-level underfill material Grant 6,727,594 - Wang , et al. April 27, 2 | 2004-04-27 |
Solder reflow with microwave energy App 20040016752 - Ratificar, Glenn ;   et al. | 2004-01-29 |
Solder reflow with microwave energy Grant 6,644,536 - Ratificar , et al. November 11, 2 | 2003-11-11 |
Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material App 20030190477 - Shi, Song-Hua ;   et al. | 2003-10-09 |
Polybenzoxazine based wafer-level underfill material App 20030137043 - Wang, Lejun ;   et al. | 2003-07-24 |
Solder reflow with microwave energy App 20030121958 - Ratificar, Glenn ;   et al. | 2003-07-03 |
Polybenzoxazine based wafer-level underfill material App 20030122241 - Wang, Lejun ;   et al. | 2003-07-03 |
No-flow reworkable epoxy underfills for flip-chip applications App 20020035201 - Wang, Lejun ;   et al. | 2002-03-21 |
Thermally degradable epoxy underfills for flip-chip applications App 20020013420 - Wang, Lejun ;   et al. | 2002-01-31 |