Patent | Date |
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Optoelectronic device with reflective surface Grant 6,864,554 - Lin , et al. March 8, 2 | 2005-03-08 |
Full-color display device Grant 6,856,087 - Lin , et al. February 15, 2 | 2005-02-15 |
Light-emitting device with improved reliability Grant 6,812,503 - Lin , et al. November 2, 2 | 2004-11-02 |
Light-emitting diode with enhanced brightness and method for fabricating the same Grant 6,809,341 - Hsu , et al. October 26, 2 | 2004-10-26 |
Light-emitting Diode With Enhanced Brightness And Method For Fabricating The Same App 20040178415 - Hsu, Jung-Kuei ;   et al. | 2004-09-16 |
Base of optoelectronic device Grant 6,791,151 - Lin , et al. September 14, 2 | 2004-09-14 |
Optoelectronic unit and transparent conductive substrate of the same Grant 6,737,679 - Lin , et al. May 18, 2 | 2004-05-18 |
Optoelectronic Unit And Transparent Conductive Substrate Of The Same App 20040069992 - Lin, Ming-Der ;   et al. | 2004-04-15 |
Base of optoelectronic device App 20040070014 - Lin, Ming-Der ;   et al. | 2004-04-15 |
Full-color display divice App 20040070333 - Lin, Ming-Der ;   et al. | 2004-04-15 |
Optoelectronic device App 20040069999 - Lin, Ming-Der ;   et al. | 2004-04-15 |
Light-emitting diode with enhanced brightness and method for fabricating the same Grant 6,716,654 - Hsu , et al. April 6, 2 | 2004-04-06 |
Structure and method for forming a high efficiency electro-optics device Grant 6,717,711 - Lin , et al. April 6, 2 | 2004-04-06 |
Method for packaging a high efficiency electro-optics device Grant 6,686,218 - Lin , et al. February 3, 2 | 2004-02-03 |
Light-emitting diode with enhanced brightness and method for fabricating the same App 20030173602 - Hsu, Jung-Kuei ;   et al. | 2003-09-18 |
Light emitting semiconductor device with a surface-mounted and flip-chip package structure Grant 6,614,058 - Lin , et al. September 2, 2 | 2003-09-02 |
Method and structure for packaging a high efficiency electro-optics device Grant 6,603,151 - Lin , et al. August 5, 2 | 2003-08-05 |
Light-emitting device with improved reliability App 20030098651 - Lin, Ming-Der ;   et al. | 2003-05-29 |
Method for packaging a high efficiency electro-optics device App 20030100140 - Lin, Ming-Der ;   et al. | 2003-05-29 |
Light emitting semiconductor device with a surface-mounted and flip-chip package structure App 20030010986 - Lin, Ming-der ;   et al. | 2003-01-16 |
Method and structure for packaging a high efficiency electro-optics device App 20020131726 - Lin, Ming-Der ;   et al. | 2002-09-19 |
Structure and method for forming a high efficiency electro-optics device App 20020131145 - Lin, Ming-Der ;   et al. | 2002-09-19 |