Wang; Jo-Mei

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wang; Jo-Mei.The latest application filed is for "package structure and manufacturing method thereof".

Company Profile

1.5.5

Wang; Jo-Mei - New Taipei TW
Wang; Jo-Mei - New Taipei City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Package structure and manufacturing method thereof Grant 10,276,542 - Huang , et al.	2019-04-30
Devices, packaging devices, and methods of packaging semiconductor devices Grant 10,177,032 - Chen , et al. J	2019-01-08
Package structures, pop devices and methods of forming the same Grant 9,941,248 - Yang , et al. April 10, 2	2018-04-10
Wafer level shielding in multi-stacked fan out packages and methods of forming same Grant 9,922,939 - Chen , et al. March 20, 2	2018-03-20
Package Structure And Manufacturing Method Thereof App 20180026010 - Huang; Li-Hsien ; et al.	2018-01-25
Package Structures, Pop Devices And Methods Of Forming The Same App 20170345795 - Yang; Tien-Chung ; et al.	2017-11-30
Wafer Level Shielding in Multi-Stacked Fan Out Packages and Methods of Forming Same App 20170256502 - Chen; Wei-Yu ; et al.	2017-09-07
Wafer level shielding in multi-stacked fan out packages and methods of forming same Grant 9,659,878 - Chen , et al. May 23, 2	2017-05-23
Wafer Level Shielding In Multi-stacked Fan Out Packages And Methods Of Forming Same App 20170110413 - Chen; Wei-Yu ; et al.	2017-04-20
Devices, Packaging Devices, and Methods of Packaging Semiconductor Devices App 20150371947 - Chen; Hsien-Wei ; et al.	2015-12-24

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