Wang; Jia Wen

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wang; Jia Wen.The latest application filed is for "bonding alignment marks at bonding interface".

Company Profile

13.8.10

Wang; Jia Wen - Wuhan CN
Wang; Jia Wen - Hubei CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Bonding Alignment Marks At Bonding Interface App 20220173038 - Yan; Meng ; et al.	2022-06-02
Wafer bonding method and structure thereof Grant 11,342,185 - Guo , et al. May 24, 2	2022-05-24
Bonding alignment marks at bonding in interface Grant 11,289,422 - Yan , et al. March 29, 2	2022-03-29
Hybrid bonding using dummy bonding contacts and dummy interconnects Grant 11,205,619 - Wang , et al. December 21, 2	2021-12-21
Hybrid bonding using dummy bonding contacts Grant 11,049,834 - Wang , et al. June 29, 2	2021-06-29
Bonding Alignment Marks At Bonding Interface App 20210072653 - Yan; Meng ; et al.	2021-03-11
Hybrid Bonding Using Dummy Bonding Contacts App 20210035941 - Wang; Tao ; et al.	2021-02-04
Hybrid bonding using dummy bonding contacts Grant 10,833,042 - Wang , et al. November 10, 2	2020-11-10
Hybrid Bonding Using Dummy Bonding Contacts And Dummy Interconnects App 20200335450 - Wang; Tao ; et al.	2020-10-22
Wafer Bonding Method And Structure Thereof App 20200273706 - GUO; Shuai ; et al.	2020-08-27
Hybrid bonding using dummy bonding contacts and dummy interconnects Grant 10,748,851 - Wang , et al. A	2020-08-18
Hybrid Bonding Using Dummy Bonding Contacts App 20200243473 - Wang; Tao ; et al.	2020-07-30
Hybrid Bonding Using Dummy Bonding Contacts And Dummy Interconnects App 20200243455 - Wang; Tao ; et al.	2020-07-30
Wafer bonding method and structure thereof Grant 10,679,854 - Guo , et al.	2020-06-09
Bonding Alignment Marks At Bonding Interface App 20200159133 - Yan; Meng ; et al.	2020-05-21
Methods for forming three-dimensional memory devices Grant 10,580,788 - Zhu , et al.	2020-03-03
Methods For Forming Three-dimensional Memory Devices App 20200027892 - Zhu; Jifeng ; et al.	2020-01-23
Wafer Bonding Method And Structure Thereof App 20190051524 - GUO; Shuai ; et al.	2019-02-14

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.