Wang; Jenn-Yue

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wang; Jenn-Yue.The latest application filed is for "method for forming a metal gapfill".

Company Profile

1.6.11

Wang; Jenn-Yue - Fremont CA
Wang; Jenn Yue - Santa Clara CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for forming a metal gapfill Grant 11,355,391 - Cen , et al. June 7, 2	2022-06-07
Methods for reducing material overhang in a feature of a substrate Grant 11,162,170 - Ritchie , et al. November 2, 2	2021-11-02
Method For Forming A Metal Gapfill App 20200303250 - CEN; Xi ; et al.	2020-09-24
Methods To Selectively Deposit Corrosion-Free Metal Contacts App 20180145034 - Xu; Yi ; et al.	2018-05-24
Method to grow thin epitaxial films at low temperature Grant 9,929,055 - Dube , et al. March 27, 2	2018-03-27
Method To Grow Thin Epitaxial Films At Low Temperature App 20170178962 - DUBE; Abhishek ; et al.	2017-06-22
Method to grow thin epitaxial films at low temperature Grant 9,530,638 - Dube , et al. December 27, 2	2016-12-27
Method To Grow Thin Epitaxial Films At Low Temperature App 20160126093 - DUBE; Abhishek ; et al.	2016-05-05
Methods For Reducing Material Overhang In A Feature Of A Substrate App 20150221486 - RITCHIE; ALAN A. ; et al.	2015-08-06
Bottom up plating by organic surface passivation and differential plating retardation Grant 8,293,647 - Wang , et al. October 23, 2	2012-10-23
Bottom Up Plating By Organic Surface Passivation And Differential Plating Retardation App 20100130007 - WANG; JENN-YUE ; et al.	2010-05-27
Oxidized barrier layer Grant 7,659,204 - Tang , et al. February 9, 2	2010-02-09
Methods For Forming Metal Interconnect Structure For Thin Film Transistor Applications App 20080254613 - Li; Yanping ; et al.	2008-10-16
Oxidized Barrier Layer App 20080237029 - TANG; Xianmin ; et al.	2008-10-02
Etch and sidewall selectivity in plasma sputtering App 20070209925 - Tang; Xianmin ; et al.	2007-09-13
Integrated process for sputter deposition of a conductive barrier layer, especially an alloy of ruthenium and tantalum, underlying copper or copper alloy seed layer App 20070059502 - Wang; Rongjun ; et al.	2007-03-15
Conductive barrier layer, especially an alloy of ruthenium and tantalum and sputter deposition thereof App 20060251872 - Wang; Jenn Yue ; et al.	2006-11-09

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