name:-0.65688800811768
name:-0.095303058624268
name:-0.0016951560974121
Wang; Jean Patent Filings

Wang; Jean

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wang; Jean.The latest application filed is for "method for identifying high-risk aml patients".

Company Profile
1.36.37
  • Wang; Jean - Toronto CA
  • Wang; Jean - La Jolla CA
  • Wang; Jean - Hsin-Chu N/A TW
  • Wang; Jean - Hsinchu N/A TW
  • Wang; Jean - Hsin Ch TW
  • Wang; Jean - Shanghai City CN
  • Wang, Jean - Taipei Hsien TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks
Patent Activity
PatentDate
Method for identifying high-risk AML patients
Grant 11,111,542 - Wang , et al. September 7, 2
2021-09-07
Method For Identifying High-risk Aml Patients
App 20190300956 - WANG; Jean ;   et al.
2019-10-03
Methods And Compositions For Treatment Of Cyanide And Hydrogen Sulfide Toxicity
App 20150353590 - Boss; Gerry ;   et al.
2015-12-10
Preventing contamination in integrated circuit manufacturing lines
Grant 9,177,843 - Sung , et al. November 3, 2
2015-11-03
Chip on wafer bonder
Grant 9,093,447 - Yu , et al. July 28, 2
2015-07-28
Clustering for prediction models in process control and for optimal dispatching
Grant 9,037,279 - Ko , et al. May 19, 2
2015-05-19
Wafer's ambiance control
Grant 8,827,695 - Hsiao , et al. September 9, 2
2014-09-09
PVD target with end of service life detection capability
Grant 8,795,486 - Hsiao , et al. August 5, 2
2014-08-05
Automatic virtual metrology for semiconductor wafer result prediction
Grant 8,682,466 - Ko , et al. March 25, 2
2014-03-25
Chip On Wafer Bonder
App 20130157412 - Yu; Chen-Hua ;   et al.
2013-06-20
Near non-adaptive virtual metrology and chamber control
Grant 8,433,434 - Wang , et al. April 30, 2
2013-04-30
Method and system for controlling copper chemical mechanical polish uniformity
Grant 8,409,993 - Ko , et al. April 2, 2
2013-04-02
Chip on wafer bonder
Grant 8,387,674 - Yu , et al. March 5, 2
2013-03-05
PVD target with end of service life detection capability
Grant 8,276,648 - Hsiao , et al. October 2, 2
2012-10-02
Pvd Target With End Of Service Life Detection Capability
App 20120131784 - Hsiao; Yi-Li ;   et al.
2012-05-31
CMP by controlling polish temperature
Grant 8,172,641 - Ho , et al. May 8, 2
2012-05-08
Methodology to enable wafer result prediction of semiconductor wafer batch processing equipment
Grant 8,145,337 - Lin , et al. March 27, 2
2012-03-27
Polishing apparatus
Grant 8,133,097 - Lin , et al. March 13, 2
2012-03-13
Apparatus for storing substrates
Grant 8,109,407 - Hsiao , et al. February 7, 2
2012-02-07
Adjustable anode assembly for a substrate wet processing apparatus
Grant 8,101,052 - Hsiao , et al. January 24, 2
2012-01-24
System for extraction of key process parameters from fault detection classification to enable wafer prediction
Grant 7,974,728 - Lin , et al. July 5, 2
2011-07-05
Stacked structures and methods of fabricating stacked structures
Grant 7,956,448 - Yu , et al. June 7, 2
2011-06-07
Pvd Target With End Of Service Life Detection Capability
App 20110126397 - Hsiao; Yi-Li ;   et al.
2011-06-02
Integrated etch and supercritical CO.sub.2 process and chamber design
Grant 7,951,723 - Wang , et al. May 31, 2
2011-05-31
Clustering for Prediction Models in Process Control and for Optimal Dispatching
App 20110060441 - Ko; Francis ;   et al.
2011-03-10
PVD target with end of service life detection capability
Grant 7,891,536 - Hsiao , et al. February 22, 2
2011-02-22
Stacked structures and methods of fabricating stacked structures
Grant 7,879,711 - Yu , et al. February 1, 2
2011-02-01
Near Non-Adaptive Virtual Metrology and Chamber Control
App 20110009998 - Wang; Amy ;   et al.
2011-01-13
Stacked Structures And Methods Of Fabricating Stacked Structures
App 20100327463 - YU; Chen-Hua ;   et al.
2010-12-30
System and method for enhanced control of copper trench sheet resistance uniformity
Grant 7,851,234 - Ko , et al. December 14, 2
2010-12-14
Polishing Apparatus
App 20100285723 - Lin; Yu-Liang ;   et al.
2010-11-11
Adjustable electrodes and coils for plasma density distribution control
Grant 7,829,815 - Chen , et al. November 9, 2
2010-11-09
Auto routing for optimal uniformity control
Grant 7,767,471 - Wang , et al. August 3, 2
2010-08-03
Substrate carrier, port apparatus and facility interface and apparatus including same
Grant 7,758,338 - Hsiao , et al. July 20, 2
2010-07-20
CMP by Controlling Polish Temperature
App 20100015894 - Ho; Ming-Che ;   et al.
2010-01-21
Novel Wafer's Ambiance Control
App 20090317214 - Hsiao; Yi-Li ;   et al.
2009-12-24
Prediction of uniformity of a wafer
Grant 7,634,325 - Wang , et al. December 15, 2
2009-12-15
Method to implement stress free polishing
Grant 7,544,606 - Wang , et al. June 9, 2
2009-06-09
System And Method For Enhanced Control Of Copper Trench Sheet Resistance Uniformity
App 20090142860 - Ko; Francis ;   et al.
2009-06-04
Chip On Wafer Bonder
App 20090142903 - Yu; Chen-Hua ;   et al.
2009-06-04
Auto Routing for Optimal Uniformity Control
App 20090035883 - Wang; Jean ;   et al.
2009-02-05
Method and system for controlling copper chemical mechanical polish uniformity
App 20080305563 - Ko; Francis ;   et al.
2008-12-11
Preventing Contamination in Integrated Circuit Manufacturing Lines
App 20080304944 - Sung; Chien-Ming ;   et al.
2008-12-11
Apparatus For Storing Substrates
App 20080295412 - Hsiao; Yi-Li ;   et al.
2008-12-04
Substrate Carrier, Port Apparatus And Facility Interface And Apparatus Including Same
App 20080298933 - Hsiao; Yi-Li ;   et al.
2008-12-04
Prediction Of Uniformity Of A Wafer
App 20080275588 - Wang; Jean ;   et al.
2008-11-06
Extraction Of Key Process Parameter
App 20080275585 - Lin; Chun-Hsien ;   et al.
2008-11-06
Methodology To Enable Wafer Result Prediction Of Batch Tools
App 20080275676 - Lin; Chun-Hsien ;   et al.
2008-11-06
Novel Methodology To Realize Automatic Virtual Metrology
App 20080275586 - Ko; Francis ;   et al.
2008-11-06
Method for dealing with traffic accident and apparatus thereof
App 20080161996 - Chang; Steve ;   et al.
2008-07-03
Stacked Structures And Methods Of Fabricating Stacked Structures
App 20080124845 - Yu; Chen-Hua ;   et al.
2008-05-29
Adjustable Anode Assembly For A Substrate Wet Processing Apparatus
App 20080121526 - Hsiao; Yi-Li ;   et al.
2008-05-29
Integrated Etch and Supercritical CO2 Process and Chamber Design
App 20080108223 - Wang; Ching-Ya ;   et al.
2008-05-08
Adjustable Electrodes And Coils For Plasma Density Distribution Control
App 20080083710 - Chen; Ying-Lin ;   et al.
2008-04-10
Method For Preventing Clogging Of Reaction Chamber Exhaust Lines
App 20080047578 - Yoo; Ming-Feng ;   et al.
2008-02-28
Method for forming dual damascenes with supercritical fluid treatments
Grant 7,332,449 - Wang , et al. February 19, 2
2008-02-19
Method for forming dual damascenes with supercritical fluid treatments
App 20070241455 - Wang; Ching-Ya ;   et al.
2007-10-18
Gas distribution apparatuses and methods for controlling gas distribution apparatuses
App 20070163716 - Hsiao; Yi-Li ;   et al.
2007-07-19
Method Of Using A Target Having End Of Service Life Detection Capability
App 20070068796 - Hsiao; Yi-Li ;   et al.
2007-03-29
Pvd Target With End Of Service Life Detection Capability
App 20070068804 - Hsiao; Yi-Li ;   et al.
2007-03-29
Pvd Target With End Of Service Life Detection Capability
App 20070068803 - Hsiao; Yi-Li ;   et al.
2007-03-29
Slurry residence time enhancement system
App 20070032180 - Hwang; Chien Ling ;   et al.
2007-02-08
Novel method to implement stress free polishing
App 20060276030 - Wang; Jean ;   et al.
2006-12-07
Systems and methods for temperature control of semiconductor wafers
App 20060023395 - Hsiao; Yi-Li ;   et al.
2006-02-02
Image transmitter
App 20050151848 - Wang, Jean ;   et al.
2005-07-14
Company Registrations
NCAGE CodeL7116WANG, JEAN
CAGE CodeL7116WANG, JEAN

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