Wang; James Jen-Ho

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wang; James Jen-Ho.The latest application filed is for "film sensors array and method".

Company Profile

2.27.26

Wang; James Jen-Ho - Phoenix AZ US
Wang; James Jen-Ho - Berlin DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Film sensors array and method Grant 10,685,944 - Wang	2020-06-16
Film Sensors Array And Method App 20180114784 - Wang; James Jen-Ho	2018-04-26
Inductor, transformer, and method Grant 9,799,448 - Wang October 24, 2	2017-10-24
Flexible circuit assembly and method therof Grant 9,704,644 - Wang July 11, 2	2017-07-11
Flexible Circuit Assembly And Method Therof App 20170186533 - Wang; James Jen-Ho	2017-06-29
Method of embedding a pre-assembled unit including a device into a flexible printed circuit and corresponding assembly Grant 9,668,352 - Wang , et al. May 30, 2	2017-05-30
Inductor, Transformer, And Method App 20160163451 - Wang; James Jen-Ho	2016-06-09
Flexible Circuit Assembly And Method Therof App 20160126010 - Wang; James Jen-Ho	2016-05-05
Intelligent lighting system Grant 9,282,596 - Wang March 8, 2	2016-03-08
Electronic fixture Grant D732,731 - Wang June 23, 2	2015-06-23
Flexible electronic assembly and method of manufacturing the same Grant 8,998,454 - Wang , et al. April 7, 2	2015-04-07
Integrated nano-farad capacitors and method of formation Grant 8,890,287 - Wang November 18, 2	2014-11-18
Flexible circuit assembly and method thereof Grant 8,879,276 - Wang November 4, 2	2014-11-04
Flexible Electronic Assembly And Method Of Manufacturing The Same App 20140268780 - WANG; James Jen-Ho ; et al.	2014-09-18
Method Of Embedding A Pre-assembled Unit Including A Device Into A Flexible Printed Circuit And Corresponding Assembly App 20140268594 - WANG; James Jen-Ho ; et al.	2014-09-18
Intelligent lighting system App 20140167618 - Wang; James Jen-Ho	2014-06-19
Flexible circuit assembly and method thereof App 20120320532 - Wang; James Jen-Ho	2012-12-20
Semiconductor bond pad patterns and method of formation Grant 8,153,510 - Wang April 10, 2	2012-04-10
Programmable anti-fuse wire bond pads App 20120061796 - Wang; James Jen-Ho	2012-03-15
Stacked device assembly with integrated coil and method of forming same Grant 7,868,729 - Wang , et al. January 11, 2	2011-01-11
Integrated nano-farad capacitors and method of formation App 20100301452 - Wang; James Jen-Ho	2010-12-02
Semiconductor bond pad patterns and method of formation App 20100279489 - Wang; James Jen-Ho	2010-11-04
Stacked Device Assembly With Integrated Coil And Method Of Forming Same App 20100225434 - Wang; James Jen-Ho ; et al.	2010-09-09
Substrate having through-wafer vias and method of forming Grant 7,705,440 - Wang April 27, 2	2010-04-27
Contact Surrounded By Passivation And Polymide And Method Therefor App 20100015793 - Wang; James Jen-Ho ; et al.	2010-01-21
Electronic device including an inductor Grant 7,619,297 - Wang November 17, 2	2009-11-17
Contact surrounded by passivation and polymide and method therefor Grant 7,615,866 - Wang , et al. November 10, 2	2009-11-10
Electronic Device Including An Inductor App 20090152676 - Wang; James Jen-Ho	2009-06-18
Process of forming an electronic device including an inductor Grant 7,524,731 - Wang April 28, 2	2009-04-28
Substrate Having Through-wafer Vias And Method Of Forming App 20090065904 - Wang; James Jen-Ho	2009-03-12
Electronic device including an inductor and a process of forming the same App 20080079115 - Wang; James Jen-Ho	2008-04-03
Multi-chips semiconductor device assemblies and methods for fabricating the same Grant 7,339,275 - Wang , et al. March 4, 2	2008-03-04
Contact Surrounded By Passivation And Polymide And Method Therefor App 20070275549 - Wang; James Jen-Ho ; et al.	2007-11-29
Semiconductor device with strain relieving bump design Grant 7,208,841 - Wang , et al. April 24, 2	2007-04-24
Multi-chips semiconductor device assemblies and methods for fabricating the same App 20060108697 - Wang; James Jen Ho ; et al.	2006-05-25
Semiconductor power device with shear stress compensation Grant 6,888,246 - Mercado , et al. May 3, 2	2005-05-03
Semiconductor device with strain relieving bump design App 20050023680 - Wang, James Jen-Ho ; et al.	2005-02-03
Semiconductor device with strain relieving bump design Grant 6,790,759 - Wang , et al. September 14, 2	2004-09-14
Semiconductor power device and method of formation App 20030232493 - Mercado, Lei L. ; et al.	2003-12-18
Semiconductor power device and method of formation Grant 6,646,347 - Mercado , et al. November 11, 2	2003-11-11
Semiconductor Power Device And Method Of Formation App 20030102563 - Mercado, Lei L. ; et al.	2003-06-05
Substrate for transferring bumps and method of use Grant 5,860,585 - Rutledge , et al. January 19, 1	1999-01-19

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.