| Patent | Date |
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Semiconductor Substrate Bonding Tool And Methods Of Operation
App 20220293436 - HUANG; Yen-Hao ; et al. | 2022-09-15 |
Extended Acid Etch For Oxide Removal
App 20220153574 - KUO; Hong-Ta ; et al. | 2022-05-19 |
Bonding Process For Forming Semiconductor Device Structure
App 20220063993 - Chang; Chih-Hang ; et al. | 2022-03-03 |
Systems and methods for semi-flexible eutectic bonder piece arranegments
Grant 11,211,354 - Chang , et al. December 28, 2 | 2021-12-28 |
Semiconductor Structures Having A Micro-Battery and Methods for Making the Same
App 20210384544 - Ni; Chyi-Tsong ; et al. | 2021-12-09 |
MEMS package with roughend interface
Grant 11,192,778 - Chen , et al. December 7, 2 | 2021-12-07 |
Rough layer for better anti-stiction deposition
Grant 11,192,775 - Chang , et al. December 7, 2 | 2021-12-07 |
Bonding process for forming semiconductor device structure
Grant 11,174,156 - Chang , et al. November 16, 2 | 2021-11-16 |
Semiconductor structures having a micro-battery and methods for making the same
Grant 11,101,491 - Ni , et al. August 24, 2 | 2021-08-24 |
Wafer Bonding Method And Wafer Bonding Apparatus
App 20210050324 - SHIH; Yun-Tai ; et al. | 2021-02-18 |
Bonding alignment tool
Grant 10,847,490 - Shih , et al. November 24, 2 | 2020-11-24 |
Mems Package With Roughend Interface
App 20200339413 - CHEN; Yu-Jui ; et al. | 2020-10-29 |
Rough anti-stiction layer for MEMS device
Grant 10,759,654 - Chen , et al. Sep | 2020-09-01 |
Bonding Process For Forming Semiconductor Device Structure
App 20200223689 - Chang; Chih-Hang ; et al. | 2020-07-16 |
MEMS package with roughend interface
Grant 10,710,872 - Chen , et al. | 2020-07-14 |
Bonding process for forming semiconductor device structure
Grant 10,626,010 - Chang , et al. | 2020-04-21 |
Rough Layer For Better Anti-stiction Deposition
App 20200024125 - Chang; Chih-Hang ; et al. | 2020-01-23 |
Bonding Alignment Tool
App 20190378813 - SHIH; Yun-Tai ; et al. | 2019-12-12 |
Semiconductor Structures Having a Micro-Battery and Methods for Making the Same
App 20190312298 - Ni; Chyi-Tsong ; et al. | 2019-10-10 |
Bonding alignment tool
Grant 10,396,054 - Shih , et al. A | 2019-08-27 |
Semiconductor structures having a micro-battery and methods for making the same
Grant 10,361,449 - Ni , et al. | 2019-07-23 |
Systems And Methods For Semi-flexible Eutectic Bonder Piece Arrangments
App 20190164929 - Chang; Chih-Hang ; et al. | 2019-05-30 |
Bonding Process For Forming Semiconductor Device Structure
App 20190161344 - CHANG; Chih-Hang ; et al. | 2019-05-30 |
Rough layer for better anti-stiction deposition
Grant 10,273,141 - Chang , et al. | 2019-04-30 |
Rough Anti-stiction Layer For Mems Device
App 20190119099 - Chen; Yu-Jui ; et al. | 2019-04-25 |
Rough anti-stiction layer for MEMS device
Grant 10,173,886 - Chen , et al. J | 2019-01-08 |
Method for forming micro-electro-mechanical system (MEMS) device structure
Grant 10,112,826 - Chang , et al. October 30, 2 | 2018-10-30 |
Rough Anti-stiction Layer For Mems Device
App 20180179047 - Chen; Yu-Jui ; et al. | 2018-06-28 |
Mems Package With Roughend Interface
App 20180162720 - Cheng; Yu-Jui ; et al. | 2018-06-14 |
Method For Forming Micro-electro-mechanical System (mems) Device Structure
App 20180148327 - CHANG; Chih-Hang ; et al. | 2018-05-31 |
Rough anti-stiction layer for MEMS device
Grant 9,884,755 - Chen , et al. February 6, 2 | 2018-02-06 |
Rough Layer for Better Anti-Stiction Deposition
App 20170305738 - Chang; Chih-Hang ; et al. | 2017-10-26 |
Preconditioning To Enhance Hydrophilic Fusion Bonding
App 20170225948 - Hsin; Chien-Ning ; et al. | 2017-08-10 |
Preconditioning to enhance hydrophilic fusion bonding
Grant 9,725,312 - Hsin , et al. August 8, 2 | 2017-08-08 |
Rough Anti-stiction Layer For Mems Device
App 20170210612 - Chen; Yu-Jui ; et al. | 2017-07-27 |
MEMS structure, cap substrate and method of fabricating the same
Grant 9,481,567 - Wang , et al. November 1, 2 | 2016-11-01 |
Semiconductor structure and fabricating process for the same
Grant 9,444,398 - Ni , et al. September 13, 2 | 2016-09-13 |
Semiconductor apparatus
Grant 9,368,390 - Ni , et al. June 14, 2 | 2016-06-14 |
Semiconductor Structures Having a Micro-Battery and Methods for Making the Same
App 20160126587 - Ni; Chyi-Tsong ; et al. | 2016-05-05 |
Semiconductor structures having a micro-battery and methods for making the same
Grant 9,240,611 - Ni , et al. January 19, 2 | 2016-01-19 |
Semiconductor Package Structure, Alignment Structure, And Alignment Method
App 20160005694 - CHIEN; Ting-Ying ; et al. | 2016-01-07 |
Semiconductor package structure, alignment structure, and alignment method
Grant 9,230,918 - Chien , et al. January 5, 2 | 2016-01-05 |
Mems Structure, Cap Substrate And Method Of Fabricating The Same
App 20150360938 - Wang; I-Shi ; et al. | 2015-12-17 |
Bonding Alignment Tool
App 20150340337 - SHIH; Yun-Tai ; et al. | 2015-11-26 |
Bonding alignment tool and method
Grant 9,123,754 - Shih , et al. September 1, 2 | 2015-09-01 |
Semiconductor Structure And Fabricating Process For The Same
App 20140209159 - NI; Chyi-Tsong ; et al. | 2014-07-31 |
Semiconductor Structures Having a Micro-Battery and Methods for Making the Same
App 20140199597 - Ni; Chyi-Tsong ; et al. | 2014-07-17 |
Semiconductor Apparatus
App 20130130496 - NI; Chyi-Tsong ; et al. | 2013-05-23 |
Bonding Alignment Tool And Method
App 20130086786 - SHIH; Yun-Tai ; et al. | 2013-04-11 |
Semiconductor apparatus including a metal alloy between a first contact and a second contact
Grant 8,378,490 - Ni , et al. February 19, 2 | 2013-02-19 |
Semiconductor Apparatus
App 20120235301 - NI; Chyi-Tsong ; et al. | 2012-09-20 |
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