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Method Of Layer Blending And Reconstruction Based On The Alpha Channel
App 20220159226 - WANG; HUNG-MING ; et al. | 2022-05-19 |
Bifacial solar cells with reflective back contacts
Grant 11,195,966 - Smith , et al. December 7, 2 | 2021-12-07 |
Structures and methods for forming electrodes of solar cells
Grant 11,127,871 - Loscutoff , et al. September 21, 2 | 2021-09-21 |
Subtractive Metallization For Solar Cells
App 20210193852 - Wang; Hung-Ming ; et al. | 2021-06-24 |
Structures And Methods For Forming Electrodes Of Solar Cells
App 20200127150 - LOSCUTOFF; Paul W. ; et al. | 2020-04-23 |
Method and apparatus for performing contactless optically-induced dielectrophoresis for separation of circulating tumor cells
Grant 10,456,791 - Wu , et al. Oc | 2019-10-29 |
Method and system for 360-degree video playback
Grant 10,462,449 - Sun , et al. Oc | 2019-10-29 |
Dual Wafer Plating Fixture For A Continuous Plating Line
App 20190301047 - Wang; Hung-Ming ; et al. | 2019-10-03 |
Method And System For 360-degree Video Playback
App 20180241984 - Sun; Min ; et al. | 2018-08-23 |
Solar Cell Having A Plurality Of Sub-cells Coupled By Cell Level Interconnection
App 20180190849 - Rim; Seung Bum ; et al. | 2018-07-05 |
Method, device and system for packing color frame and original depth frame
Grant 9,832,446 - Yang , et al. November 28, 2 | 2017-11-28 |
Method And Apparatus For Performing Contactless Optically-induced Dielectrophoresis For Separation Of Circulating Tumor Cells
App 20170297036 - WU; MIN-HSIEN ; et al. | 2017-10-19 |
Unpacking method, unpacking device and unpacking system of packed frame
Grant 9,774,844 - Yang , et al. September 26, 2 | 2017-09-26 |
Electrical connector with electrical contacts protected by a layer of compressible material and method of making it
Grant 9,680,273 - Light , et al. June 13, 2 | 2017-06-13 |
Bifacial Solar Cells With Reflective Back Contacts
App 20170077336 - Smith; David D. ; et al. | 2017-03-16 |
Method, device and system for restoring resized depth frame into original depth frame
Grant 9,529,825 - Yang , et al. December 27, 2 | 2016-12-27 |
Method, device and system for resizing original depth frame into resized depth frame
Grant 9,521,428 - Yang , et al. December 13, 2 | 2016-12-13 |
Method, Device And System For Restoring Resized Depth Frame Into Original Depth Frame
App 20150093020 - YANG; Jar-Ferr ; et al. | 2015-04-02 |
Method, Device And System For Packing Color Frame And Original Depth Frame
App 20150092029 - YANG; Jar-Ferr ; et al. | 2015-04-02 |
Method, Device And System For Resizing Original Depth Frame Into Resized Depth Frame
App 20150092848 - YANG; Jar-Ferr ; et al. | 2015-04-02 |
Unpacking Method, Unpacking Device And Unpacking System Of Packed Frame
App 20150092028 - YANG; Jar-Ferr ; et al. | 2015-04-02 |
Electrical Connector with Electrical Contacts Protected by a Layer of Compressible Material and Method of Making It
App 20140273641 - Light; David Noel ; et al. | 2014-09-18 |
Image Conversion Method And Module For Naked-eye 3d Display
App 20140204175 - YANG; Jar-Ferr ; et al. | 2014-07-24 |
Method of forming contact layers on substrates
Grant 7,704,880 - Uzoh , et al. April 27, 2 | 2010-04-27 |
Method of forming contact layers on substrates
Grant 7,416,975 - Uzoh , et al. August 26, 2 | 2008-08-26 |
Efficient wafer processing technology
Grant 7,257,893 - Wang , et al. August 21, 2 | 2007-08-21 |
Method of forming contact layers on substrates
App 20070066054 - Uzoh; Cyprian E. ; et al. | 2007-03-22 |
Efficient wafer processing technology
App 20070050974 - Wang; Hung-Ming ; et al. | 2007-03-08 |
Microelectronic assemblies having low profile connections
App 20060275951 - Warner; Michael ; et al. | 2006-12-07 |
Microelectronic assemblies having low profile connections
Grant 7,098,074 - Warner , et al. August 29, 2 | 2006-08-29 |
Microelectronic assemblies having low profile connections
App 20040219716 - Warner, Michael ; et al. | 2004-11-04 |
Process and apparatus for air bubble removal during electrochemical processing
App 20040182715 - Bogart, Jeffrey ; et al. | 2004-09-23 |
Method for treating spent tin/lead stripping solution
Grant 6,685,820 - Chen , et al. February 3, 2 | 2004-02-03 |
Method for treating spent tin/lead stripping solution
App 20030200838 - Chen, Kuo-Chin ; et al. | 2003-10-30 |
Graded metallic leads for connection to microelectronic elements
Grant 6,573,459 - Baker , et al. June 3, 2 | 2003-06-03 |
Graded metallic leads for connection to microelectronic elements
App 20020180012 - Baker, David R. ; et al. | 2002-12-05 |
Graded Metallic Leads For Connection To Microelectronic Elements
App 20020115356 - BAKER, DAVID R. ; et al. | 2002-08-22 |
Layered lead structures
Grant 6,255,723 - Light , et al. July 3, 2 | 2001-07-03 |
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