Wang; Hui-Heng
Patent Applications and Registrations
Patent applications and USPTO patent grants for Wang; Hui-Heng.The latest application filed is for "led die structure and method for manufacturing the bottom terminal thereof".
- Wang; Hui-Heng - Taoyuan County TW
- Wang; Hui-Heng - Taoyuan TW
- Wang; Hui-Heng - Taoyuan City TW
| Patent | Date |
|---|---|
| Semiconductor chip pad structure and method for manufacturing the same Grant 8,169,086 - Wang May 1, 2 | 2012-05-01 |
| Led Die Structure And Method For Manufacturing The Bottom Terminal Thereof App 20110241059 - WANG; HUI-HENG | 2011-10-06 |
| Semiconductor Chip Pad Structure And Method For Manufacturing The Same App 20100264453 - WANG; HUI-HENG | 2010-10-21 |
| Fabrication method of high-brightness light emitting diode having reflective layer Grant 7,384,808 - Liu , et al. June 10, 2 | 2008-06-10 |
| High-brightness light emitting diode having reflective layer Grant 7,335,924 - Liu , et al. February 26, 2 | 2008-02-26 |
| Light emitting diode having enhanced side emitting capability App 20070181905 - Wang; Hui-Heng ; et al. | 2007-08-09 |
| Fabrication method of high-brightness light emitting diode having reflective layer App 20070020788 - Liu; Jin-Hsiang ; et al. | 2007-01-25 |
| High-brightness light emitting diode having reflective layer App 20070012937 - Liu; Jin-Hsiang ; et al. | 2007-01-18 |
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