Wang; Hsing-Seng
Patent Applications and Registrations
Patent applications and USPTO patent grants for Wang; Hsing-Seng.The latest application filed is for "one-step semiconductor stack packaging method".
- Wang; Hsing-Seng - Hsinchu TW
- Wang; Hsing-Seng - Tauyuan TW
- Wang; Hsing-Seng - Tau-Yuan TW
- Wang; Hsing-Seng - Chung Li TW
- Wang; Hsing Seng - Tan-Yuan TW
| Patent | Date |
|---|---|
| Stacked semiconductor package formed on a substrate and method for fabrication Grant 6,590,282 - Wang , et al. July 8, 2 | 2003-07-08 |
| One-step bumping/bonding method for forming semiconductor packages Grant 6,536,653 - Wang , et al. March 25, 2 | 2003-03-25 |
| One-step semiconductor stack packaging method Grant 6,479,321 - Wang , et al. November 12, 2 | 2002-11-12 |
| One-step Semiconductor Stack Packaging Method App 20020137255 - Wang, Hsing-Seng ; et al. | 2002-09-26 |
| One-step bumping/bonding method for forming semiconductor packages App 20020092894 - Wang, Hsing-Seng ; et al. | 2002-07-18 |
| Flip chip chip-scale package Grant 6,255,140 - Wang July 3, 2 | 2001-07-03 |
| Method for dispensing underfill and devices formed Grant 6,207,475 - Lin , et al. March 27, 2 | 2001-03-27 |
| Thermally and electrically enhanced PBGA package Grant 5,977,626 - Wang , et al. November 2, 1 | 1999-11-02 |
| Heat sink bonded to a die paddle having at least one aperture Grant 5,783,860 - Jeng , et al. July 21, 1 | 1998-07-21 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 