Wang; Hsien-Shou

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wang; Hsien-Shou.The latest application filed is for "structure of circuit board and method for fabricating the same".

Company Profile

0.8.11

Wang; Hsien-Shou - Taoyuan N/A TW
Wang; Hsien-Shou - Hsin-chu TW
Wang; Hsien-Shou - Hsinchu TW
Wang; Hsien-Shou - Hsin-feng TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Structure of circuit board and method for fabricating the same Grant 8,709,940 - Wang , et al. April 29, 2	2014-04-29
Structure Of Circuit Board And Method For Fabricating The Same App 20110154664 - Wang; Shing-Ru ; et al.	2011-06-30
Structure of circuit board and method for fabricating same Grant 7,906,850 - Wang , et al. March 15, 2	2011-03-15
Flip-chip package substrate and a method for fabricating the same Grant 7,867,888 - Wang January 11, 2	2011-01-11
Method for fabricating a flip chip substrate structure Grant 7,820,233 - Chen , et al. October 26, 2	2010-10-26
Coreless package substrate with conductive structures Grant 7,626,270 - Chen , et al. December 1, 2	2009-12-01
Method to manufacture a coreless packaging substrate Grant 7,435,618 - Chen , et al. October 14, 2	2008-10-14
Method to manufacture a coreless packaging substrate Grant 7,419,850 - Chen , et al. September 2, 2	2008-09-02
Package Substrate And Manufacturing Method Thereof App 20080122079 - Chen; Bo-Wei ; et al.	2008-05-29
Method for fabricating a flip chip substrate structure App 20080075836 - Chen; Bo-Wei ; et al.	2008-03-27
Flip chip substrate structure and the method for manufacturing the same App 20080060838 - Chen; Bo-Wei ; et al.	2008-03-13
Flip-chip package substrate and a method for fabricating the same App 20080029894 - Wang; Hsien-Shou	2008-02-07
Method of manufacturing a coreless package substrate and conductive structure of the substrate App 20070246744 - Chen; Bo-Wei ; et al.	2007-10-25
Method to manufacture a coreless packaging substrate App 20070249155 - Chen; Bo-Wei ; et al.	2007-10-25
Method to manufacture a coreless packaging substrate App 20070249154 - Chen; Bo-Wei ; et al.	2007-10-25
Structure of circuit board and method for fabricating same App 20070138630 - Wang; Shing-Ru ; et al.	2007-06-21
Circuit Board Structure And Method For Fabricating The Same App 20070017815 - Wang; Shing-Ru ; et al.	2007-01-25
Structure of circuit board and method for fabricating the same App 20060284640 - Wang; Shing-Ru ; et al.	2006-12-21

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