Wang; Hsiang-Wei
Patent Applications and Registrations
Patent applications and USPTO patent grants for Wang; Hsiang-Wei.The latest application filed is for "top via pattern for bond pad structure".
- Wang; Hsiang-Wei - Hsin-Chu TW
- Wang; Hsiang-Wei - Hsin-Chu City TW
| Patent | Date |
|---|---|
| Top via pattern for bond pad structure Grant 7,323,784 - Yiu , et al. January 29, 2 | 2008-01-29 |
| Top via pattern for bond pad structure App 20060208360 - Yiu; Ho-Yin ; et al. | 2006-09-21 |
| Method for combining via patterns into a single mask Grant 7,087,350 - Wang August 8, 2 | 2006-08-08 |
| Method for combining via patterns into a single mask App 20050110146 - Wang, Hsiang Wei | 2005-05-26 |
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