WANG; Honghui

Patent Applications and Registrations

Patent applications and USPTO patent grants for WANG; Honghui.The latest application filed is for "packaging structure and fabrication method thereof".

Company Profile

3.15.19

WANG; Honghui - Nantong CN
Wang; Honghui - Beijing CN
WANG; Honghui - Dalian Liaoning
WANG; Honghui - Qingdao CN
Wang; Honghui - Sichuan CN
Wang; Honghui - Chengdu CN
Wang; Honghui - Jiangsu CN
Wang; Honghui - Xiamen CN
Wang; Honghui - Guangzhou CN
Wang; Honghui - Guangdong CN
Wang; Honghui - Palatine IL

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks

Patent Activity

Patent	Date
Packaging Structure And Fabrication Method Thereof App 20220270982 - MIAO; Xiaoyong ; et al.	2022-08-25
Array substrate, manufacturing method thereof, and display Grant 11,307,471 - Liu , et al. April 19, 2	2022-04-19
Array Substrate, Manufacturing Method Thereof, And Display App 20210389636 - LIU; Mingxuan ; et al.	2021-12-16
Prediction Method Of Part Surface Roughness And Tool Wear Based On Multi-task Learning App 20210364482 - WANG; Yongqing ; et al.	2021-11-25
Pile Leg Walking Type Mining Robot App 20210009248 - LIU; Guijie ; et al.	2021-01-14
System-level packaging structures Grant 10,741,499 - Tao , et al. A	2020-08-11
Array substrate and manufacturing method thereof, display panel and display device Grant 10,720,450 - Wang	2020-07-21
Water pumping and injecting multi-layered concentric sphere neutron spectrometer Grant 10,656,292 - Yang , et al.	2020-05-19
Array Substrate And Manufacturing Method Thereof, Display Panel And Display Device App 20180294282 - WANG; Honghui	2018-10-11
Water pumping and injecting multi-layered concentric sphere neutron spectrometer App 20180224565 - Yang; Jianbo ; et al.	2018-08-09
Line detecting apparatus and method for array substrate Grant 9,891,264 - Wang February 13, 2	2018-02-13
Structure and method of reinforcing a conductor soldering point of semiconductor device Grant 9,837,371 - Shi , et al. December 5, 2	2017-12-05
Structure And Method Of Reinforcing A Conductor Soldering Point Of Semiconductor Device App 20170207189 - SHI; Haizhong ; et al.	2017-07-20
System-level Packaging Structures App 20170077035 - TAO; Yujuan ; et al.	2017-03-16
System-level packaging methods and structures Grant 9,543,269 - Tao , et al. January 10, 2	2017-01-10
PtCu and PtNi Electrocatalysts Doped with Iodine App 20160226073 - Tong; YuYe J. ; et al.	2016-08-04
Metal contact for semiconductor device Grant 9,379,077 - Lin , et al. June 28, 2	2016-06-28
Semiconductor Device Package And Packaging Method App 20150303159 - LIN; Chang-Ming ; et al.	2015-10-22
Array Substrate, Method For Repairing The Same And Display Apparatus App 20150227011 - Zhang; Ming ; et al.	2015-08-13
Three-dimensional system-level packaging methods and structures Grant 9,099,448 - Tao , et al. August 4, 2	2015-08-04
Line Detecting Apparatus And Method For Array Substrate App 20140375347 - Wang; Honghui	2014-12-25
System-level Packaging Methods And Structures App 20130320534 - Tao; Yujuan ; et al.	2013-12-05
Three-dimensional System-level Packaging Methods And Structures App 20130320535 - Tao; Yujuan ; et al.	2013-12-05
Method and system for recognizing a handwritten character Grant 8,396,295 - Gao , et al. March 12, 2	2013-03-12
Method And System For Recognizing A Handwritten Character App 20110311141 - Gao; Jinglian ; et al.	2011-12-22
Acousto-optic activity for acoustic imaging Grant 6,741,382 - Sonpatki , et al. May 25, 2	2004-05-25
Acousto-optic reflection-active imaging Grant 6,628,451 - Sandhu , et al. September 30, 2	2003-09-30
Acousto-optic Reflection-active Imaging App 20030151794 - Sandhu, Jaswinder S. ; et al.	2003-08-14

Company Registrations

NCAGE Code	3SBE5	WANG HONGHUI
CAGE Code	3SBE5	WANG, HONGHUI

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