Wang; Hezhi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wang; Hezhi.The latest application filed is for "copper-clad laminate, printed circuit board and method for manufacturing printed circuit board".

Company Profile

12.5.13

Wang; Hezhi - Shenzhen CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Sound absorbing material, method for process same and speaker using same Grant 11,140,475 - Tang , et al. October 5, 2	2021-10-05
Sound absorbing material and speaker box using same Grant 11,109,149 - Feng , et al. August 31, 2	2021-08-31
Molecular sieve, preparation thereof and acoustic absorption material and speaker containing the same Grant 11,014,820 - Tang , et al. May 25, 2	2021-05-25
Sound absorbing material and speaker box using same Grant 10,939,195 - Dai , et al. March 2, 2	2021-03-02
Copper-Clad Laminate, Printed Circuit Board and Method for Manufacturing Printed Circuit Board App 20210059048 - Wang; Hongyuan ; et al.	2021-02-25
Prepreg, Copper-clad Laminate And Printed Circuit Board App 20210054158 - Wang; Hongyuan ; et al.	2021-02-25
Sound Adsorbing Material And Speaker Box App 20200211524 - Feng; Hongshu ; et al.	2020-07-02
Sound Absorbing Material, Method Processing Same And Speaker Box Using Same App 20200031679 - Tang; Kun ; et al.	2020-01-30
Low-frequency Improvement Material And Speaker System Using Same App 20200031678 - Feng; Hongshu ; et al.	2020-01-30
Sound Absorbing Material And Speaker Box Using Same App 20200037062 - Dai; Jiqiang ; et al.	2020-01-30
Sound Absorbing Material And Speaker Box Using Same App 20200037063 - Feng; Hongshu ; et al.	2020-01-30
Sound Absorbing Material, Method For Process Same And Speaker Using Same App 20200037065 - Tang; Kun ; et al.	2020-01-30
Sound Absorbing Material And Speaker Using Same App 20200037066 - Feng; Hongshu ; et al.	2020-01-30
Acoustic device Grant 10,506,333 - Wang Dec	2019-12-10
Molecular sieve, preparation thereof and acoustic absorption material and speaker containing the same App 20190202706 - Tang; Kun ; et al.	2019-07-04
Acoustic Device App 20180352322 - WANG; HeZhi	2018-12-06
Acoustic Device App 20150358721 - WANG; HeZhi	2015-12-10

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