Wang; Gencai
Patent Applications and Registrations
Patent applications and USPTO patent grants for Wang; Gencai.The latest application filed is for "clip for heat sink".
- Wang; Gencai - Shenzhen CN
| Patent | Date |
|---|---|
| Clip for heat sink Grant 6,754,080 - Lee , et al. June 22, 2 | 2004-06-22 |
| Clip for heat sink App 20040052053 - Lee, Hsieh Kun ; et al. | 2004-03-18 |
| Heat sink assembly with spring clamp Grant 6,644,387 - Lee , et al. November 11, 2 | 2003-11-11 |
| Heat sink Grant D481,688 - Lee , et al. November 4, 2 | 2003-11-04 |
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