Wang; Fu-Hsien

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wang; Fu-Hsien.The latest application filed is for "method for fabricating side by side light emitting diode (led) having separate electrical and heat transfer paths".

Company Profile

0.7.5

Wang; Fu-Hsien - Sinpu Township N/A TW
Wang; Fu-Hsien - Xinpu Township TW
Wang; Fu-Hsien - Xinpu Township, Hsinchu County N/A TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of fabricating semiconductor die using handling layer Grant 8,802,469 - Chu , et al. August 12, 2	2014-08-12
Method for fabricating side by side light emitting diode (LED) having separate electrical and heat transfer paths Grant 8,716,041 - Doan , et al. May 6, 2	2014-05-06
Method For Fabricating Side By Side Light Emitting Diode (led) Having Separate Electrical And Heat Transfer Paths App 20130337590 - DOAN; TRUNG TRI ; et al.	2013-12-19
Side by side light emitting diode (LED) having separate electrical and heat transfer paths Grant 8,552,458 - Doan , et al. October 8, 2	2013-10-08
Side By Side Light Emitting Diode (LED) Having Separate Electrical And Heat Transfer Paths And Method Of Fabrication App 20110316034 - Doan; Trung Tri ; et al.	2011-12-29
Method Of Separating Semiconductor Dies App 20110217799 - Chu; Chen-Fu ; et al.	2011-09-08
Method of separating semiconductor dies Grant 7,968,379 - Chu , et al. June 28, 2	2011-06-28
Method Of Separating Semiconductor Dies App 20090093075 - Chu; Chen-Fu ; et al.	2009-04-09
Method of separating semiconductor dies Grant 7,452,739 - Chu , et al. November 18, 2	2008-11-18
Method Of Separating Semiconductor Dies App 20070212854 - Chu; Chen-Fu ; et al.	2007-09-13

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