WANG; Feng-Ku
Patent Applications and Registrations
Patent applications and USPTO patent grants for WANG; Feng-Ku.The latest application filed is for "wireless expanding system and wireless expanding method".
Company Profile
0.33.42
- WANG; Feng-Ku - TAIPEI CITY TW
- Wang; Feng-Ku - Taipei TW
- Wang; Feng-Ku - Taoyuan County TW
Patent Activity
| Patent | Date |
|---|---|
| Wireless Expanding System And Wireless Expanding Method App 20180129468 - WANG; Feng-Ku ; et al. | 2018-05-10 |
| Electronic apparatus Grant 9,740,253 - Cheng , et al. August 22, 2 | 2017-08-22 |
| Electronic Apparatus App 20170153677 - CHENG; Yi-Lun ; et al. | 2017-06-01 |
| Computer device with heat-dissipation channels Grant 9,557,785 - Lin , et al. January 31, 2 | 2017-01-31 |
| Computer Device With Heat-dissipation Channels App 20160124473 - LIN; Chun-Chi ; et al. | 2016-05-05 |
| Selective Assembling Type Computing Device App 20150346793 - WANG; Feng-Ku ; et al. | 2015-12-03 |
| Electronic device including a jet flow generator Grant 9,131,626 - Wang , et al. September 8, 2 | 2015-09-08 |
| Electronic device Grant 9,119,323 - Wang , et al. August 25, 2 | 2015-08-25 |
| Inputting Mode Switching Method And System Utilizing The Same App 20150138102 - CHANG; Hui ; et al. | 2015-05-21 |
| Electronic device Grant 9,029,696 - Wang , et al. May 12, 2 | 2015-05-12 |
| Electronic device and heat dissipation module thereof Grant 8,897,012 - Wang , et al. November 25, 2 | 2014-11-25 |
| Electronic Device App 20140083655 - Wang; Feng-Ku ; et al. | 2014-03-27 |
| Electronic Device App 20140085819 - Wang; Feng-Ku ; et al. | 2014-03-27 |
| Electronic Device And Heat Conduction Element Thereof App 20140085825 - Wang; Feng-Ku ; et al. | 2014-03-27 |
| Method for testing heat pipes Grant 8,641,271 - Wang , et al. February 4, 2 | 2014-02-04 |
| Electronic Device And Heat Dissipation Module Thereof App 20130294030 - Wang; Feng-Ku ; et al. | 2013-11-07 |
| Electronic apparatus with improved heat dissipation Grant 8,542,486 - Lin , et al. September 24, 2 | 2013-09-24 |
| Electronic Device App 20130240182 - Wang; Feng-Ku ; et al. | 2013-09-19 |
| Mobile computing apparatus Grant 8,482,916 - Wang , et al. July 9, 2 | 2013-07-09 |
| Method for detecting performances of heat dissipation modules Grant 8,388,221 - Wang , et al. March 5, 2 | 2013-03-05 |
| Circuit module and electronic device using the same Grant 8,363,400 - Wang , et al. January 29, 2 | 2013-01-29 |
| Method for estimating fan life Grant 8,340,922 - Wang , et al. December 25, 2 | 2012-12-25 |
| Mobile Computing Apparatus App 20120194995 - Wang; Feng-Ku ; et al. | 2012-08-02 |
| Circuit Module And Electronic Device Using The Same App 20120134112 - WANG; Feng-Ku ; et al. | 2012-05-31 |
| Electronic Apparatus And Keyboard Supporting Module Thereof App 20120127662 - SUN; Kuang-Chung ; et al. | 2012-05-24 |
| Heat Dissipating Device App 20120125570 - WANG; Feng-Ku ; et al. | 2012-05-24 |
| Electronic Apparatus With Improved Heat Dissipation App 20120127652 - LIN; Wei-Yi ; et al. | 2012-05-24 |
| Method for simulating thermal resistance value of thermal test die Grant 8,078,438 - Wang , et al. December 13, 2 | 2011-12-13 |
| Heat dissipation module Grant 7,954,541 - Wang , et al. June 7, 2 | 2011-06-07 |
| Method For Estimating Fan Life App 20110125418 - Wang; Feng Ku ; et al. | 2011-05-26 |
| Method For Testing Heat Pipes App 20110122915 - Wang; Feng Ku ; et al. | 2011-05-26 |
| Method For Detecting Performances Of Heat Dissipation Modules App 20110122914 - WANG; Feng Ku ; et al. | 2011-05-26 |
| Heat sink structure Grant 7,946,336 - Wang , et al. May 24, 2 | 2011-05-24 |
| Electronic device and heat sink thereof Grant 7,940,528 - Wang , et al. May 10, 2 | 2011-05-10 |
| Heat dissipation device Grant 7,826,227 - Wang , et al. November 2, 2 | 2010-11-02 |
| Automatic coating device Grant 7,757,627 - Cheng , et al. July 20, 2 | 2010-07-20 |
| Electronic Device And Heat Sink Thereof App 20100053892 - WANG; Feng-Ku ; et al. | 2010-03-04 |
| Anti-turbulent Casing App 20100014247 - Wang; Feng-Ku ; et al. | 2010-01-21 |
| Loop Heat Pipe App 20090321055 - WANG; FENG-KU ; et al. | 2009-12-31 |
| Folding protective cover for heat-conductive medium Grant 7,589,969 - Wang , et al. September 15, 2 | 2009-09-15 |
| Heatsink Module Having Fin Assembly Structure Corresponding To Heat Pipe App 20090211737 - WANG; Feng-Ku ; et al. | 2009-08-27 |
| Heat sink structure App 20090211729 - Wang; Feng-Ku ; et al. | 2009-08-27 |
| Heat dissipation device App 20090201647 - Wang; Feng-Ku ; et al. | 2009-08-13 |
| Retaining Device App 20090201646 - YANG; Chih-Kai ; et al. | 2009-08-13 |
| Chassis Of Portable Electronic Apparatus App 20090201639 - WANG; Feng-Ku ; et al. | 2009-08-13 |
| Heat-dissipating module Grant 7,564,686 - Wang , et al. July 21, 2 | 2009-07-21 |
| Heat-dissipating module and electronic apparatus Grant 7,558,062 - Wang , et al. July 7, 2 | 2009-07-07 |
| Heat Dissipation Module App 20090056925 - Wang; Feng-Ku ; et al. | 2009-03-05 |
| Heat-dissipating Module App 20090034193 - Wang; Feng-Ku ; et al. | 2009-02-05 |
| Heat-dissipating Module App 20090034196 - Wang; Feng-Ku ; et al. | 2009-02-05 |
| Heat-dissipating Module App 20090034195 - Wang; Feng-Ku ; et al. | 2009-02-05 |
| Heat-dissipating Module And Electronic Apparatus App 20090016020 - Wang; Feng-Ku ; et al. | 2009-01-15 |
| Method For Simulating Thermal Resistance Value Of Thermal Test Die App 20090006048 - Wang; Feng-Ku ; et al. | 2009-01-01 |
| Heatsink apparatus Grant 7,463,484 - Wang , et al. December 9, 2 | 2008-12-09 |
| Heatsink module Grant 7,457,119 - Wang , et al. November 25, 2 | 2008-11-25 |
| Heat sink fixing assembly Grant 7,436,673 - Wang , et al. October 14, 2 | 2008-10-14 |
| Heat plate construction and attachment for dismounting heat plate App 20080216997 - Wang; Feng-Ku ; et al. | 2008-09-11 |
| Heat Sink Module For Dual Heat Sources App 20080198550 - Wang; Feng-Ku ; et al. | 2008-08-21 |
| Heatsink module App 20080192434 - Wang; Feng-Ku ; et al. | 2008-08-14 |
| Heatsink apparatus App 20080186675 - Wang; Feng-Ku ; et al. | 2008-08-07 |
| Heat sink module for dual heat sources Grant 7,405,937 - Wang , et al. July 29, 2 | 2008-07-29 |
| Heat plate fixing structure Grant 7,388,747 - Yang , et al. June 17, 2 | 2008-06-17 |
| Fixing structure of heat conduction pad App 20080130240 - Wang; Feng-Ku ; et al. | 2008-06-05 |
| Heat sink module for dissipating heat from a heat source on a motherboard Grant 7,339,787 - Cheng , et al. March 4, 2 | 2008-03-04 |
| Folding protective cover for heat-conductive medium App 20070243345 - Wang; Feng-Ku ; et al. | 2007-10-18 |
| Heat sink module for dissipating heat from a heat source on a motherboard App 20070242436 - Cheng; Yi-Lun ; et al. | 2007-10-18 |
| Heat conducting medium protection device App 20070235177 - Wang; Feng-Ku ; et al. | 2007-10-11 |
| Heat plate fixing structure App 20070236886 - Yang; Chih-Kai ; et al. | 2007-10-11 |
| Automatic coating device App 20070137565 - Cheng; Yi-Lun ; et al. | 2007-06-21 |
| Heat sink modular structure inside an electronic product Grant 6,373,700 - Wang April 16, 2 | 2002-04-16 |
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