Wang; Ching-Ya

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wang; Ching-Ya.The latest application filed is for "tunnel field-effect transistors with superlattice channels".

Company Profile

0.15.13

Wang; Ching-Ya - Taipei N/A TW
Wang; Ching-Ya - Hsin-Chu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Tunnel field-effect transistors with superlattice channels Grant 8,669,163 - Bhuwalka , et al. March 11, 2	2014-03-11
Contact barrier structure and manufacturing methods Grant 8,030,210 - Wang , et al. October 4, 2	2011-10-04
Integrated etch and supercritical CO.sub.2 process and chamber design Grant 7,951,723 - Wang , et al. May 31, 2	2011-05-31
Tunnel Field-Effect Transistors with Superlattice Channels App 20110027959 - Bhuwalka; Krishna Kumar ; et al.	2011-02-03
Tunnel field-effect transistors with superlattice channels Grant 7,834,345 - Bhuwalka , et al. November 16, 2	2010-11-16
Contact Barrier Structure and Manufacturing Methods App 20100167485 - Wang; Ching-Ya ; et al.	2010-07-01
Contact barrier structure and manufacturing methods Grant 7,709,903 - Wang , et al. May 4, 2	2010-05-04
Method for passivating gate dielectric films Grant 7,667,247 - Wang , et al. February 23, 2	2010-02-23
Method to create damage-free porous low-k dielectric films and structures resulting therefrom Grant 7,588,995 - Yu , et al. September 15, 2	2009-09-15
System and method for forming a semiconductor device source/drain contact Grant 7,538,398 - Ke , et al. May 26, 2	2009-05-26
System and Method for Forming a Semiconductor Device Source/Drain Contact App 20080315321 - Ke; Chung-Hu ; et al.	2008-12-25
Contact barrier structure and manufacturing methods App 20080290421 - Wang; Ching-Ya ; et al.	2008-11-27
Method For Passivating Gate Dielectric Films App 20080242071 - Wang; Ching-Ya ; et al.	2008-10-02
Method for improving low-K dielectrics by supercritical fluid treatments Grant 7,387,973 - Wang , et al. June 17, 2	2008-06-17
Integrated Etch and Supercritical CO2 Process and Chamber Design App 20080108223 - Wang; Ching-Ya ; et al.	2008-05-08
Surface modification of a porous organic material through the use of a supercritical fluid Grant 7,354,623 - Wang , et al. April 8, 2	2008-04-08
Method for forming dual damascenes with supercritical fluid treatments Grant 7,332,449 - Wang , et al. February 19, 2	2008-02-19
Dual damascene cleaning method Grant 7,329,956 - Yu , et al. February 12, 2	2008-02-12
Repairing method for low-k dielectric materials Grant 7,314,828 - Lin , et al. January 1, 2	2008-01-01
Method for forming dual damascenes with supercritical fluid treatments App 20070241455 - Wang; Ching-Ya ; et al.	2007-10-18
Method to create damage-free porous Low-k dielectric films and structures resulting therefrom App 20070111535 - Yu; Chen-Hua ; et al.	2007-05-17
Repairing method for low-k dielectric materials App 20070020952 - Lin; Keng-Chu ; et al.	2007-01-25
Method for improving low-K dielectrics by supercritical fluid treatments App 20060073697 - Wang; Ching-Ya ; et al.	2006-04-06
Surface modification of a porous organic material through the use of a supercritical fluid App 20050260402 - Wang, Ching-Ya ; et al.	2005-11-24
Method of integrating post-etching cleaning process with deposition for semiconductor device App 20050158664 - Tseng, Joshua ; et al.	2005-07-21
System and method for dampening high pressure impact on porous materials Grant 6,875,285 - Wang , et al. April 5, 2	2005-04-05
System and method for dampening high pressure impact on porous materials App 20040211440 - Wang, Ching-Ya ; et al.	2004-10-28

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