Wang; Chin-Te

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wang; Chin-Te.The latest application filed is for "routing design of dummy metal cap and redistribution line".

Company Profile

1.6.4

Wang; Chin-Te - Taipei TW
Wang; Chin-Te - Taipei City TW
Wang; Chin-te - Hsinchu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Routing design of dummy metal cap and redistribution line Grant 11,031,352 - Yu , et al. June 8, 2	2021-06-08
Routing Design of Dummy Metal Cap and Redistribution Line App 20190341360 - Yu; Chen-Hua ; et al.	2019-11-07
Routing design of dummy metal cap and redistribution line Grant 10,354,961 - Yu , et al. July 16, 2	2019-07-16
Routing Design of Dummy Metal Cap and Redistribution Line App 20180261557 - Yu; Chen-Hua ; et al.	2018-09-13
Routing design of dummy metal cap and redistribution line Grant 9,972,581 - Yu , et al. May 15, 2	2018-05-15
Integrated fan-out package, semiconductor device, and method of fabricating the same Grant 9,812,426 - Wang , et al. November 7, 2	2017-11-07
High frequency flip chip package structure of polymer substrate Grant 8,258,606 - Chang , et al. September 4, 2	2012-09-04
High frequency flip chip package process of polymer substrate and structure thereof Grant 8,033,039 - Chang , et al. October 11, 2	2011-10-11
High Frequency Flip Chip Package Structure Of Polymer Substrate App 20110186974 - Chang; Edward-yi ; et al.	2011-08-04
High Frequency Flip Chip Package Process of Polymer Substrate and Structure thereof App 20100248430 - Chang; Edward-yi ; et al.	2010-09-30

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