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Semiconductor Structure And Manufacturing Method Thereof
App 20210305116 - TSAO; PEI-HAW ; et al. | 2021-09-30 |
Semiconductor structure and manufacturing method thereof
Grant 11,037,849 - Tsao , et al. June 15, 2 | 2021-06-15 |
Semiconductor Structure And Manufacturing Method Thereof
App 20200075449 - TSAO; PEI-HAW ; et al. | 2020-03-05 |
Semiconductor structure and manufacturing method thereof
Grant 10,475,719 - Tsao , et al. Nov | 2019-11-12 |
Method of forming bandgap reference integrated circuit
Grant 10,211,202 - Jou , et al. Feb | 2019-02-19 |
Semiconductor Structure And Manufacturing Method Thereof
App 20180308779 - TSAO; PEI-HAW ; et al. | 2018-10-25 |
Semiconductor structure and manufacturing method thereof
Grant 10,020,239 - Tsao , et al. July 10, 2 | 2018-07-10 |
Method Of Forming Bandgap Reference Integrated Circuit
App 20180145067 - JOU; Chewn-Pu ; et al. | 2018-05-24 |
Circuit with a droop compensating mechanism
Grant 9,972,995 - Jou , et al. May 15, 2 | 2018-05-15 |
Bandgap reference circuit
Grant 9,876,008 - Jou , et al. January 23, 2 | 2018-01-23 |
Semiconductor Structure And Manufacturing Method Thereof
App 20170200664 - TSAO; PEI-HAW ; et al. | 2017-07-13 |
MiM capacitor
Grant 9,502,886 - Wang , et al. November 22, 2 | 2016-11-22 |
Metal oxide metal capacitor with slot vias
Grant 9,425,330 - Wang , et al. August 23, 2 | 2016-08-23 |
Bandgap Reference Circuit
App 20160049912 - JOU; Chewn-Pu ; et al. | 2016-02-18 |
Circuit With A Droop Compensating Mechanism
App 20160013633 - Jou; Chewn-Pu ; et al. | 2016-01-14 |
MiM CAPACITOR
App 20140265632 - Wang; Chien-Jung ; et al. | 2014-09-18 |
Method of forming an interconnect structure having an enlarged region
Grant 8,785,323 - Wang July 22, 2 | 2014-07-22 |
Seal ring structures with reduced moisture-induced reliability degradation
Grant 8,729,705 - Wang , et al. May 20, 2 | 2014-05-20 |
Seal Ring Structures With Reduced Moisture-induced Reliability Degradation
App 20140103496 - Wang; Chien-Jung ; et al. | 2014-04-17 |
Seal ring structures with reduced moisture-induced reliability degradation
Grant 8,674,508 - Wang , et al. March 18, 2 | 2014-03-18 |
Method Of Forming An Interconnect Structure Having An Enlarged Region
App 20130316073 - Wang; Chien-Jung | 2013-11-28 |
Method of forming an interconnect structure having an enlarged region
Grant 8,513,115 - Wang August 20, 2 | 2013-08-20 |
Metal Oxide Metal Capacitor With Slot Vias
App 20130127016 - WANG; Chin-Shan ; et al. | 2013-05-23 |
Metal oxide metal capacitor with slot vias
Grant 8,379,365 - Wang , et al. February 19, 2 | 2013-02-19 |
Interconnect Structure to Reduce Stress Induced Voiding Effect
App 20120263868 - Wang; Chien-Jung | 2012-10-18 |
Interconnect structure to reduce stress induced voiding effect
Grant 8,227,923 - Wang July 24, 2 | 2012-07-24 |
Interconnect Structure to Reduce Stress Induced Voiding Effect
App 20110285031 - Wang; Chien-Jung | 2011-11-24 |
Interconnect structure to reduce stress induced voiding effect
Grant 8,013,451 - Wang September 6, 2 | 2011-09-06 |
Seal Ring Structures with Reduced Moisture-Induced Reliability Degradation
App 20110108945 - Wang; Chien-Jung ; et al. | 2011-05-12 |
Seal ring structures with reduced moisture-induced reliability degradation
Grant 7,893,459 - Wang , et al. February 22, 2 | 2011-02-22 |
Test structure with TDDB test pattern
Grant 7,851,793 - Wang , et al. December 14, 2 | 2010-12-14 |
Metal Oxide Metal Capacitor With Slot Vias
App 20100271753 - WANG; Chin-Shan ; et al. | 2010-10-28 |
Method for measuring a property of interconnections and structure for the same
Grant 7,646,207 - Lin , et al. January 12, 2 | 2010-01-12 |
Interconnect Structure to Reduce Stress Induced Voiding Effect
App 20090134526 - Wang; Chien-Jung | 2009-05-28 |
Interconnect structure to reduce stress induced voiding effect
Grant 7,504,731 - Wang March 17, 2 | 2009-03-17 |
Method For Measuring A Property Of Interconnections And Structure For The Same
App 20090058434 - Lin; Jian-Hong ; et al. | 2009-03-05 |
Flexible metal-oxide-metal capacitor design
Grant 7,485,912 - Wang February 3, 2 | 2009-02-03 |
Seal ring structures with reduced moisture-induced reliability degradation
App 20080251923 - Wang; Chien-Jung ; et al. | 2008-10-16 |
Test structure with TDDB test pattern
App 20080122476 - Wang; Chien-Jung ; et al. | 2008-05-29 |
Bump Structures And Packaged Structures Thereof
App 20080042269 - Niu; Pao-Kang ; et al. | 2008-02-21 |
Wiring structure to minimize stress induced void formation
Grant 7,301,239 - Wang , et al. November 27, 2 | 2007-11-27 |
Flexible metal-oxide-metal capacitor design
App 20070235838 - Wang; Chien-Jung | 2007-10-11 |
Interconnect Structure to Reduce Stress Induced Voiding Effect
App 20070200247 - Wang; Chien-Jung | 2007-08-30 |
Interconnect structure to reduce stress induced voiding effect
Grant 7,227,266 - Wang June 5, 2 | 2007-06-05 |
Novel Test Structure For Speeding A Stress-induced Voiding Test And Method Of Using The Same
App 20070109008 - Wang; Chien-Jung | 2007-05-17 |
Test structure for speeding a stress-induced voiding test and method of using same
Grant 7,157,925 - Wang January 2, 2 | 2007-01-02 |
Interconnect structure to reduce stress induced voiding effect
App 20060099794 - Wang; Chien-Jung | 2006-05-11 |
Wiring structure to minimize stress induced void formation
App 20060019414 - Wang; Chien-Jung ; et al. | 2006-01-26 |
Novel test structure for speeding a stress-induced voiding test and method of using same
App 20050224792 - Wang, Chien-Jung | 2005-10-13 |
Test structure for detecting bridging of DRAM capacitors
Grant 6,934,206 - Wang August 23, 2 | 2005-08-23 |
Test structure and related methods for evaluating stress-induced voiding
Grant 6,897,475 - Wang May 24, 2 | 2005-05-24 |
Method and apparatus for stress testing integrated circuits using an adjustable AC hot carrier injection source
Grant 6,815,971 - Wang , et al. November 9, 2 | 2004-11-09 |
Test Structure And Related Methods For Evaluating Stress-induced Voiding
App 20040207383 - Wang, Chien-Jung | 2004-10-21 |
Novel test structure for detecting bridging of DRAM capacitors
App 20040153275 - Wang, Chien-Jung | 2004-08-05 |
Method and apparatus for stress testing integrated circuits using an adjustable AC hot carrier injection source
App 20040085084 - Wang, Chien-Jung ; et al. | 2004-05-06 |
Test structure for detecting bridging of DRAM capacitors
Grant 6,617,180 - Wang September 9, 2 | 2003-09-09 |
Method Of Fabricating Gate
App 20020064919 - WANG, CHIEN-JUNG | 2002-05-30 |
Fabrication method of a device isolation structure
Grant 6,258,694 - Wang , et al. July 10, 2 | 2001-07-10 |
Method for forming a borderless contact
Grant 6,258,712 - Wang July 10, 2 | 2001-07-10 |
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