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Patent applications and USPTO patent grants for WANG; Chieh-Ping.The latest application filed is for "semiconductor device with isolation structure".
Patent | Date |
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Semiconductor Device With Isolation Structure App 20220293596 - WANG; Chieh-Ping ;   et al. | 2022-09-15 |
Multi-Layered Insulating Film Stack App 20220278000 - Wang; Chieh-Ping ;   et al. | 2022-09-01 |
Semiconductor device with isolation structure Grant 11,348,917 - Wang , et al. May 31, 2 | 2022-05-31 |
Multi-layered insulating film stack Grant 11,335,603 - Wang , et al. May 17, 2 | 2022-05-17 |
Multi-layered Insulating Film Stack App 20210407807 - Wang; Chieh-Ping ;   et al. | 2021-12-30 |
Semiconductor Device With Isolation Structure App 20210343709 - WANG; Chieh-Ping ;   et al. | 2021-11-04 |
Semiconductor Devices And Methods Of Manufacture App 20210335657 - Lu; Bo-Cyuan ;   et al. | 2021-10-28 |
Cut metal gate devices and processes Grant 11,152,262 - Lee , et al. October 19, 2 | 2021-10-19 |
Cut Metal Gate Refill With Void App 20210313181 - Chen; Ting-Gang ;   et al. | 2021-10-07 |
Cut Metal Gate Devices and Processes App 20200176259 - Lee; Chun-Yi ;   et al. | 2020-06-04 |
Ball Screw With A Support Device App 20180156322 - YU; Szu-Wei ;   et al. | 2018-06-07 |
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