Wang; Chi-Yu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wang; Chi-Yu.The latest application filed is for "broadcast receiver".

Company Profile

0.7.14

Wang; Chi-Yu - Kaohsiung TW
WANG; Chi-Yu - New Taipel City TW
Wang; Chi-Yu - Taoyuan TW
WANG; Chi-Yu - Taoyuan City TW
Wang; Chi-Yu - Kaohsiung City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and method for manufacturing the same Grant 11,404,333 - Lin , et al. August 2, 2	2022-08-02
Broadcast Receiver App 20220060268 - WANG; Chi-Yu ; et al.	2022-02-24
Method of supplying electric power to a computer system Grant 11,175,715 - Wang November 16, 2	2021-11-16
Semiconductor Device Package And Method For Manufacturing The Same App 20210305192 - CHU; Ming Hsien ; et al.	2021-09-30
Semiconductor device structure having semiconductor die bonded to redistribution layer via electrical pad with barrier layer Grant 11,101,237 - Chu , et al. August 24, 2	2021-08-24
Method Of Supplying Electric Power To A Computer System App 20210191492 - WANG; Chi-Yu	2021-06-24
Semiconductor device package and method for manufacturing the same Grant 11,037,898 - Chu , et al. June 15, 2	2021-06-15
Wiring Structure, Semiconductor Device Structure And Method For Manufacturing The Same App 20200402949 - CHU; Ming Hsien ; et al.	2020-12-24
Semiconductor Device Package And Method For Manufacturing The Same App 20200303335 - CHU; Ming Hsien ; et al.	2020-09-24
Semiconductor device structure having semiconductor die bonded to redistribution layer via electrical pad with barrier layer Grant 10,763,234 - Chu , et al. Sep	2020-09-01
Semiconductor Device And Method For Manufacturing The Same App 20200243406 - LIN; Yuan-Ting ; et al.	2020-07-30
Wiring Structure, Semiconductor Device Structure And Method For Manufacturing The Same App 20200118936 - CHU; Ming Hsien ; et al.	2020-04-16
Semiconductor devices and methods of manufacturing the same Grant 9,773,753 - Lin , et al. September 26, 2	2017-09-26
Stacking die package structure for semiconductor devices and method of the same App 20090127686 - Yang; Wen-Kun ; et al.	2009-05-21
Method for removing residual flux App 20070207606 - Wang; Chun-Chi ; et al.	2007-09-06
Chip Structure And Manufacturing Process Thereof App 20060199306 - Tsai; Mon-Chin ; et al.	2006-09-07
Chip Structure And Wafer Structure App 20060197191 - Tsai; Mon-Chin ; et al.	2006-09-07
Wafer level assembly package Grant 7,071,544 - Wang , et al. July 4, 2	2006-07-04
Redistribution Layer And Circuit Structure Thereof App 20060103020 - Tong; Ho-Ming ; et al.	2006-05-18
Wafer level assembly package App 20040150119 - Wang, Chi-Yu ; et al.	2004-08-05

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