Wang; Chi-An

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wang; Chi-An.The latest application filed is for "semiconductor structure and manufacturing method thereof".

Company Profile

9.6.12

Wang; Chi-An - Taichung City TW
Wang; Chi-An - Hsinchu County TW
Wang; Chi-An - Hukou Township Hsinchu County TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Structure And Manufacturing Method Thereof App 20220068939 - Wang; Chi-An ; et al.	2022-03-03
Manufacturing method and a related stackable chip package Grant 11,024,603 - Chen , et al. June 1, 2	2021-06-01
Chip package structure and manufacturing method thereof Grant 10,424,526 - Wang , et al. Sept	2019-09-24
Manufacturing Method And A Related Stackable Chip Package App 20190244934 - Chen; Ming-Chih ; et al.	2019-08-08
Stacked package including exterior conductive element and a manufacturing method of the same Grant 10,354,978 - Chen , et al. July 16, 2	2019-07-16
Stacked Package And A Manufacturing Method Of The Same App 20190214367 - Chen; Ming-Chih ; et al.	2019-07-11
Stacked Package Including Exterior Conductive Element And A Manufacturing Method Of The Same App 20190214366 - Chen; Ming-Chih ; et al.	2019-07-11
Chip package structure and manufacturing method thereof Grant 10,276,553 - Wang , et al.	2019-04-30
Chip package structure and manufacturing method thereof Grant 10,177,060 - Wang , et al. J	2019-01-08
Manufacturing method of package-on-package structure Grant 10,170,458 - Wang , et al. J	2019-01-01
Chip Package Structure And Manufacturing Method Thereof App 20180114734 - Wang; Chi-An ; et al.	2018-04-26
Package Structure And Manufacturing Method Thereof App 20180114781 - Wang; Chi-An ; et al.	2018-04-26
Method of forming package-on-package structure App 20180114786 - Hsu; Hung-Hsin ; et al.	2018-04-26
Manufacturing Method Of Package-on-package Structure App 20180114782 - Wang; Chi-An ; et al.	2018-04-26
Manufacturing Method Of Package-on-package Structure App 20180114704 - Wang; Chi-An ; et al.	2018-04-26
Chip Package Structure And Manufacturing Method Thereof App 20180114736 - Wang; Chi-An ; et al.	2018-04-26
Chip Package Structure And Manufacturing Method Thereof App 20180114783 - Wang; Chi-An ; et al.	2018-04-26
Package-on-package Structure And Manufacturing Method Thereof App 20170358557 - Chen; Yu-Wei ; et al.	2017-12-14

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