Wang; Bo-Shun
Patent Applications and Registrations
Patent applications and USPTO patent grants for Wang; Bo-Shun.The latest application filed is for "method for forming lead-carbon compound interface layer on lead-based substrate".
- Wang; Bo-Shun - Yunlin County TW
| Patent | Date |
|---|---|
| Method for forming lead-carbon compound interface layer on lead-based substrate Grant 11,349,110 - Hsieh , et al. May 31, 2 | 2022-05-31 |
| Method For Forming Lead-carbon Compound Interface Layer On Lead-based Substrate App 20200227720 - Hsieh; Shu-Huei ; et al. | 2020-07-16 |
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