Wang; Bau-Ming

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wang; Bau-Ming.The latest application filed is for "method of implantation for semiconductor device".

Company Profile

4.5.5

Wang; Bau-Ming - Kaohsiung TW
Wang; Bau-Ming - Kaohsiung City TW
Wang; Bau-Ming - Hsinchu N/A TW
Wang; Bau-Ming - HSINCHU CITY 300 TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of forming a semiconductor device with implantation of impurities at high temperature Grant 11,450,743 - Wang , et al. September 20, 2	2022-09-20
Fin semiconductor device having a stepped gate spacer sidewall Grant 11,374,108 - Chen , et al. June 28, 2	2022-06-28
Method of Implantation for Semiconductor Device App 20220123111 - Wang; Bau-Ming ; et al.	2022-04-21
Method And Device To Reduce Epitaxial Defects Due To Contact Stress Upon A Semicondcutor Wafer App 20220059394 - LIU; Sih-Jie ; et al.	2022-02-24
Semiconductor Device And Manufacturing Method Thereof App 20200373405 - CHEN; Yi-Lun ; et al.	2020-11-26
Method of manufacturing a protective stack on a semiconductor fin Grant 10,741,667 - Chen , et al. A	2020-08-11
Semiconductor Device And Manufacturing Method Thereof App 20190267465 - CHEN; Yi-Lun ; et al.	2019-08-29
Method of semiconductor manufacturing process Grant 8,906,778 - Wu , et al. December 9, 2	2014-12-09
Method Of Semiconductor Manufacturing Process App 20120231614 - Wu; YewChung Sermon ; et al.	2012-09-13

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