| Patent | Date |
|---|
Thin, Multi-lens, Optical Fingerprint Sensor Adapted To Image Through Cell Phone Displays
App 20220230011 - WAN; Tsung-Wei ; et al. | 2022-07-21 |
Structure light module using vertical cavity surface emitting laser array and folding optical element
Grant 11,280,988 - Chen , et al. March 22, 2 | 2022-03-22 |
Structure Light Module Using Vertical Cavity Surface Emitting Laser Array And Folding Optical Element
App 20200073097 - Wan; Tsung-Wei ; et al. | 2020-03-05 |
Camera module having baffle between two glass substrates
Grant 10,469,718 - Wan , et al. No | 2019-11-05 |
Wafer-level methods for packing camera modules, and associated camera modules
Grant 10455131 - | 2019-10-22 |
Wafer-level lens packaging methods, and associated lens assemblies and camera modules
Grant 10,437,025 - Wan , et al. O | 2019-10-08 |
Structure light module using vertical cavity surface emitting laser array
Grant 10,333,277 - Wan , et al. | 2019-06-25 |
Structure Light Module Using Vertical Cavity Surface Emitting Laser Array
App 20190131771 - Wan; Tsung-Wei ; et al. | 2019-05-02 |
Camera Module Having Baffle Between Two Glass Substrates
App 20180324336 - Wan; Tsung-Wei ; et al. | 2018-11-08 |
Bezels for die level packaging of camera modules, and associated camera modules and methods
Grant 10,122,903 - Chen , et al. November 6, 2 | 2018-11-06 |
Ultra-small camera module with wide field of view, and associate lens systems and methods
Grant 10,075,636 - Wan , et al. September 11, 2 | 2018-09-11 |
Stacked-lens assembly and fabrication method for same
Grant 9,915,763 - Chen , et al. March 13, 2 | 2018-03-13 |
Wide-angle camera using achromatic doublet prism array and method of manufacturing the same
Grant 9,902,120 - Chen , et al. February 27, 2 | 2018-02-27 |
Bezels For Die Level Packaging Of Camera Modules, And Associated Camera Modules And Methods
App 20170374252 - Chen; Wei-Ping ; et al. | 2017-12-28 |
Wafer-level hybrid compound lens and method for fabricating same
Grant 9,804,367 - Wan , et al. October 31, 2 | 2017-10-31 |
Ultra-Small Camera Module With Wide Field Of View, And Associate Lens Systems And Methods
App 20170310890 - Wan; Tsung Wei ; et al. | 2017-10-26 |
Stacked-Lens Assembly And Fabrication Method For Same
App 20170139086 - Chen; Wei-Ping ; et al. | 2017-05-18 |
Wafer-Level Hybrid Compound Lens And Method For Fabricating Same
App 20170123190 - Wan; Tsung-Wei ; et al. | 2017-05-04 |
Wafer level stepped sensor holder
Grant 9,467,606 - Wan , et al. October 11, 2 | 2016-10-11 |
PCB-mountable lens adapter for a PCB-mountable camera module
Grant 9,451,137 - Chen , et al. September 20, 2 | 2016-09-20 |
Wide-Angle Camera Using Achromatic Doublet Prism Array And Method of Manufacturing The Same
App 20160231473 - Chen; Wei-Ping ; et al. | 2016-08-11 |
Wafer-Level Methods For Packing Camera Modules, And Associated Camera Modules
App 20160219203 - Wan; Tsung-Wei ; et al. | 2016-07-28 |
Wafer-level Lens Packaging Methods, And Associated Lens Assemblies And Camera Modules
App 20160216493 - Wan; Tsung-Wei ; et al. | 2016-07-28 |
Suspended lens system having a non-zero optical transmission substrate facing the concave surface of a single-piece lens and wafer-level method for manufacturing the same
Grant 9,349,765 - Wan , et al. May 24, 2 | 2016-05-24 |
PCB-Mountable Lens Adapter For A PCB-Mountable Camera Module
App 20160057323 - Chen; Wei-Ping ; et al. | 2016-02-25 |
Wafer Level Stepped Sensor Holder
App 20150358510 - Wan; Tsung-Wei ; et al. | 2015-12-10 |
Suspended Lens Systems And Wafer-Level Methods For Manufacturing The Same
App 20150333094 - Wan; Tsung Wei ; et al. | 2015-11-19 |
Compact Spacer In Multi-lens Array Module
App 20150116562 - Wan; Tsung-Wei ; et al. | 2015-04-30 |
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