Waltrich; Uwe

Patent Applications and Registrations

Patent applications and USPTO patent grants for Waltrich; Uwe.The latest application filed is for "securing power semiconductor components to curved surfaces".

Company Profile

4.2.12

Waltrich; Uwe - Forchheim DE
Waltrich; Uwe - Erlangen DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Securing Power Semiconductor Components To Curved Surfaces App 20220254652 - Lasch; Markus ; et al.	2022-08-11
Semiconductor Component On A Heat Pipe App 20220225549 - Waltrich; Uwe	2022-07-14
Arrangement of electrical modules, converter and aircraft with such an arrangement, and method for producing the arrangement Grant 11,324,142 - Waltrich May 3, 2	2022-05-03
Power converter module and method for production thereof Grant 11,296,054 - Richter , et al. April 5, 2	2022-04-05
Power Supply For Electric And/or Electronic Components App 20210380268 - Ruppert; Swen ; et al.	2021-12-09
Method Of Manufacturing A Power Semiconductor Component Arrangement Or A Power Semiconductor Component Housing App 20210327724 - ZIESCHE; Steffen ; et al.	2021-10-21
Arrangement Of Electrical Modules, Converter And Aircraft With Such An Arrangement, And Method For Producing The Arrangement App 20210219456 - Waltrich; Uwe	2021-07-15
Power Converter Cooling In Aviation App 20210179285 - Waltrich; Uwe	2021-06-17
Cooling Arrangement For Electrical Components, Converter With A Cooling Arrangement, And Aircraft Having A Converter App 20210153394 - Mitic; Gerhard ; et al.	2021-05-20
Organic Circuit Carrier And Application Thereof In Power Converters And In Vehicles App 20210100091 - Waltrich; Uwe	2021-04-01
Power Converter Module And Method For Production Thereof App 20200152611 - Richter; Rene ; et al.	2020-05-14
Electrically Conductive Bond Between At Least Two Electrical Components At A Carrier Mounted With Electronic And/or Electrical Devices, Said Bond Being Formed By A Bond Wire App 20180166413 - Bayer; Christoph ; et al.	2018-06-14

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