Walter; David N.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Walter; David N..The latest application filed is for "method for fabricating array-molded package-on-package".

Company Profile

0.8.11

Walter; David N. - Dallas TX
Walter; David N - Dallas TX
Walter; David N. - Richardson TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for Fabricating Array-Molded Package-on-Package App 20140030851 - Gerber; Mark A. ; et al.	2014-01-30
Method for fabricating array-molded package-on-package Grant 8,574,967 - Gerber , et al. November 5, 2	2013-11-05
Method for Fabricating Array-Molded Package-on-Package App 20130189814 - Gerber; Mark A. ; et al.	2013-07-25
Array-molded package-on-package having redistribution lines Grant 8,304,285 - Gerber , et al. November 6, 2	2012-11-06
Array-Molded Package-On-Package Having Redistribution Lines App 20110183465 - GERBER; Mark A. ; et al.	2011-07-28
Method for Fabricating Array-Molded Package-on-Package App 20110165731 - GERBER; Mark A. ; et al.	2011-07-07
Array molded package-on-package having redistribution lines Grant 7,944,034 - Gerber , et al. May 17, 2	2011-05-17
Controlling flip-chip techniques for concurrent ball bonds in semiconductor devices Grant 7,776,653 - Walter , et al. August 17, 2	2010-08-17
Controlling Flip-Chip Techniques for Concurrent Ball Bonds in Semiconductor Devices App 20090269883 - Walter; David N. ; et al.	2009-10-29
Controlling flip-chip techniques for concurrent ball bonds in semiconductor devices Grant 7,573,137 - Walter , et al. August 11, 2	2009-08-11
Array molded package-on-package having redistribution lines App 20080315385 - Gerber; Mark A. ; et al.	2008-12-25
Method for Fabricating Array-Molded Package-On-Package App 20080284045 - Gerber; Mark A. ; et al.	2008-11-20
Controlling Flip-Chip Techniques for Concurrent Ball Bonds in Semiconductor Devices App 20070228543 - Walter; David N. ; et al.	2007-10-04
Two-metal layer ball grid array and chip scale package having local interconnects used in wire-bonded and flip-chip semiconductor assembly App 20040217486 - Walter, David N. ; et al.	2004-11-04
Two-metal layer ball grid array and chip scale package having local interconnects used in wire-bonded and flip-chip semiconductor assembly Grant 6,717,276 - Walter , et al. April 6, 2	2004-04-06
HID land grid array packaged device having electrical and optical interconnects Grant 6,707,124 - Wachtler , et al. March 16, 2	2004-03-16
Two-metal Layer Ball Grid Array And Chip Scale Package Having Local Interconnects Used In Wire-bonded And Flip-chip Semiconductor Assembly App 20040046265 - Walter, David N. ; et al.	2004-03-11
HID land grid array packaged device having electrical and optical interconnects App 20010035576 - Wachtler, Kurt P. ; et al.	2001-11-01
HDI land grid array packaged device having electrical and optical interconnects Grant 6,274,391 - Wachtler , et al. August 14, 2	2001-08-14

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