loadpatents
name:-0.011439085006714
name:-0.013297080993652
name:-0.0004270076751709
Walsh; Thomas A. Patent Filings

Walsh; Thomas A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Walsh; Thomas A..The latest application filed is for "method of grinding wafer stacks to provide uniform residual silicon thickness".

Company Profile
0.15.10
  • Walsh; Thomas A. - Atascadero CA
  • Walsh; Thomas A. - San Luis Obispo CA
  • Walsh; Thomas A. - Templeton CA
  • Walsh; Thomas A - Templeton CA
  • Walsh; Thomas A. - Santa Ana CA
  • Walsh; Thomas A. - Fountain Valley CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Methods and systems for use in grind spindle alignment
Grant 9,610,669 - Walsh , et al. April 4, 2
2017-04-04
Systems and methods of processing substrates
Grant 9,393,669 - Kalenian , et al. July 19, 2
2016-07-19
Method of grinding wafer stacks to provide uniform residual silicon thickness
Grant 9,082,713 - Brake , et al. July 14, 2
2015-07-14
Method Of Grinding Wafer Stacks To Provide Uniform Residual Silicon Thickness
App 20150118826 - Kalenian; William J. ;   et al.
2015-04-30
Systems and methods of wafer grinding
Grant 8,968,052 - Walsh , et al. March 3, 2
2015-03-03
Methods And Systems For Use In Grind Spindle Alignment
App 20140134927 - Walsh; Thomas A. ;   et al.
2014-05-15
Method, apparatus and system for use in processing wafers
Grant 8,565,919 - Kalenian , et al. October 22, 2
2013-10-22
Systems And Methods Of Processing Substrates
App 20130130593 - Kalenian; William J. ;   et al.
2013-05-23
Systems And Methods Of Wafer Grinding
App 20130102227 - Walsh; Thomas A. ;   et al.
2013-04-25
Grinding apparatus having an extendable wheel mount
Grant 8,133,093 - Vogtmann , et al. March 13, 2
2012-03-13
Grinding apparatus having an extendable wheel mount
App 20100093264 - Vogtmann; Michael ;   et al.
2010-04-15
Grinding apparatus and method
Grant 7,458,878 - Walsh , et al. December 2, 2
2008-12-02
Grinding apparatus and method
App 20070128983 - Walsh; Thomas A. ;   et al.
2007-06-07
Wafer Carrier Pivot Mechanism
App 20070105491 - Walsh; Thomas A. ;   et al.
2007-05-10
Wafer carrier pivot mechanism
Grant 7,156,946 - Walsh , et al. January 2, 2
2007-01-02
Grinding apparatus and method
Grant 7,118,446 - Walsh , et al. October 10, 2
2006-10-10
Chemical-mechanical planarization tool force calibration method and system
App 20060205322 - Kalenian; William ;   et al.
2006-09-14
Chemical-mechanical planarization tool force calibration method and system
Grant 7,040,955 - Kalenian , et al. May 9, 2
2006-05-09
Wafer carrier pivot mechanism
App 20040226656 - Walsh, Thomas A. ;   et al.
2004-11-18
Grinding apparatus and method
App 20040198196 - Walsh, Thomas A. ;   et al.
2004-10-07
Grinding process and apparatus for planarizing sawed wafers
Grant 5,964,646 - Kassir , et al. October 12, 1
1999-10-12
Semiconductor wafer polishing appartus and method
Grant 5,605,487 - Hileman , et al. February 25, 1
1997-02-25
Lap shaping machine with oscillatable point cutter and selectively rotatable or oscillatable lap
Grant 4,380,412 - Walsh April 19, 1
1983-04-19
Lap milling machine
Grant 3,986,433 - Walsh , et al. October 19, 1
1976-10-19
Company Registrations
SEC0001441798WALSH THOMAS A

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