Wallichs; Gary Brian
Patent Applications and Registrations
Patent applications and USPTO patent grants for Wallichs; Gary Brian.The latest application filed is for "micro-network-on-chip and microsector infrastructure".
- Wallichs; Gary Brian - San Jose CA
| Patent | Date |
|---|---|
| Micro-network-on-chip And Microsector Infrastructure App 20220197855 - Ganusov; Ilya K. ; et al. | 2022-06-23 |
| Interface Bridge Between Integrated Circuit Die App 20220121595 - Schulz; Jeffrey Erik ; et al. | 2022-04-21 |
| Distributed Multi-die Protocol Application Interface App 20220066977 - Wallichs; Gary Brian ; et al. | 2022-03-03 |
| Interface bridge between integrated circuit die Grant 11,237,998 - Schulz , et al. February 1, 2 | 2022-02-01 |
| Distributed multi-die protocol application interface Grant 11,169,951 - Wallichs , et al. November 9, 2 | 2021-11-09 |
| Interface bridge between integrated circuit die Grant 11,100,029 - Schulz , et al. August 24, 2 | 2021-08-24 |
| Interface Bridge Between Integrated Circuit Die App 20210109883 - Schulz; Jeffrey Erik ; et al. | 2021-04-15 |
| Distributed Multi-die Protocol Application Interface App 20210064566 - Wallichs; Gary Brian ; et al. | 2021-03-04 |
| Distributed multi-die protocol application interface Grant 10,936,531 - Wallichs , et al. March 2, 2 | 2021-03-02 |
| Distributed Multi-die Protocol Application Interface App 20200183877 - Wallichs; Gary Brian ; et al. | 2020-06-11 |
| Distributed multi-die protocol application interface Grant 10,565,155 - Wallichs , et al. Feb | 2020-02-18 |
| Integrated circuits having expandable processor memory Grant 10,509,757 - Kim , et al. Dec | 2019-12-17 |
| Interface Bridge Between Integrated Circuit Die App 20190361831 - Schulz; Jeffrey Erik ; et al. | 2019-11-28 |
| Interface bridge between integrated circuit die Grant 10,445,278 - Schulz , et al. Oc | 2019-10-15 |
| Distributed Multi-die Protocol Application Interface App 20190179792 - Wallichs; Gary Brian ; et al. | 2019-06-13 |
| Distributed multi-die protocol application interface Grant 10,162,789 - Wallichs , et al. Dec | 2018-12-25 |
| Backchannel Transmission Adaptation App 20180191530 - Wallichs; Gary Brian ; et al. | 2018-07-05 |
| Interface Bridge Between Integrated Circuit Die App 20180181524 - Schulz; Jeffrey Erik ; et al. | 2018-06-28 |
| Integrated Circuits Having Expandable Processor Memory App 20180081696 - Kim; Paul ; et al. | 2018-03-22 |
| Backchannel transmission adaptation Grant 9,923,738 - Wallichs , et al. March 20, 2 | 2018-03-20 |
| Multiple-die synchronous insertion delay measurement circuit and methods Grant 9,595,308 - Wallichs , et al. March 14, 2 | 2017-03-14 |
| Distributed Multi-die Protocol Application Interface App 20170068638 - Wallichs; Gary Brian ; et al. | 2017-03-09 |
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