Walk; Michael
Patent Applications and Registrations
Patent applications and USPTO patent grants for Walk; Michael.The latest application filed is for "leadframe for a semiconductor component".
- Walk; Michael - Pilsach DE
- Walk; Michael - Mesa AZ
| Patent | Date |
|---|---|
| Leadframe for a semiconductor component Grant 10,347,590 - Pola , et al. July 9, 2 | 2019-07-09 |
| Leadframe For A Semiconductor Component App 20170309580 - Pola; Olivier ; et al. | 2017-10-26 |
| Methods for manufacturing imprinted substrates Grant 7,637,008 - Dory , et al. December 29, 2 | 2009-12-29 |
| Substrate-imprinting methods Grant 7,594,321 - Dory , et al. September 29, 2 | 2009-09-29 |
| I/O Architecture for integrated circuit package Grant 7,589,414 - He , et al. September 15, 2 | 2009-09-15 |
| Electronic packages and components thereof formed by substrate-imprinting Grant 7,371,975 - Dory , et al. May 13, 2 | 2008-05-13 |
| I/o Architecture For Integrated Circuit Package App 20080088009 - He; Jiangqi ; et al. | 2008-04-17 |
| I/O architecture for integrated circuit package Grant 7,329,946 - He , et al. February 12, 2 | 2008-02-12 |
| Substrate-imprinting Apparatus And Methods App 20080000674 - Dory; Thomas S. ; et al. | 2008-01-03 |
| Multi-layer integrated circuit package Grant 7,245,001 - Coomer , et al. July 17, 2 | 2007-07-17 |
| System And Apparatus For Forming An Imprinting Tool App 20070056454 - Walk; Michael | 2007-03-15 |
| Methods for forming an imprinting tool Grant 7,186,365 - Walk March 6, 2 | 2007-03-06 |
| Method and apparatus for substrate fabrication App 20060172061 - Kohmura; Toshimi ; et al. | 2006-08-03 |
| Enhancing epoxy strength using kaolin filler App 20050287714 - Walk, Michael ; et al. | 2005-12-29 |
| I/O architecture for integrated circuit package App 20050145885 - He, Jianqi ; et al. | 2005-07-07 |
| Multi-layer integrated circuit package Grant 6,899,815 - Coomer , et al. May 31, 2 | 2005-05-31 |
| I/O architecture for integrated circuit package Grant 6,897,556 - He , et al. May 24, 2 | 2005-05-24 |
| I/O architecture for integrated circuit package App 20050051906 - He, Jianqi ; et al. | 2005-03-10 |
| Multi-layer integrated circuit package App 20050009353 - Coomer, Boyd L. ; et al. | 2005-01-13 |
| Method and apparatus for forming an imprinting tool App 20040247732 - Walk, Michael | 2004-12-09 |
| Substrate-imprinting apparatus, methods of manufacture, and products formed therefrom App 20040118604 - Dory, Thomas S. ; et al. | 2004-06-24 |
| Imprinted substrate and methods of manufacture App 20040118594 - Dory, Thomas S. ; et al. | 2004-06-24 |
| Multi-layer integrated circuit package App 20030184987 - Coomer, Boyd L. ; et al. | 2003-10-02 |
| Capacitor with extended surface lands and method of fabrication therefor Grant 6,483,692 - Figueroa , et al. November 19, 2 | 2002-11-19 |
| Interposer substrate with low inductance capacitive paths Grant 6,477,034 - Chakravorty , et al. November 5, 2 | 2002-11-05 |
| Capacitor with extended surface lands and method of fabrication therefor App 20020075630 - Figueroa, David G. ; et al. | 2002-06-20 |
| Electronic package having embedded capacitors and method of fabrication therefor Grant 6,407,929 - Hale , et al. June 18, 2 | 2002-06-18 |
| Electronic assembly with trench structures and methods of manufacture Grant 6,388,207 - Figueroa , et al. May 14, 2 | 2002-05-14 |
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