Walczyk; Joe F.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Walczyk; Joe F..The latest application filed is for "micro socket electrical couplings for dies".

Company Profile

4.7.22

Walczyk; Joe F. - Tigard OR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Sloped metal features for cooling hotspots in stacked-die packages Grant 11,398,414 - Wan , et al. July 26, 2	2022-07-26
Micro Socket Electrical Couplings For Dies App 20220200183 - NEKKANTY; Srikant ; et al.	2022-06-23
Stackable Photonics Die With Direct Optical Interconnect App 20220196915 - COONS; Todd R. ; et al.	2022-06-23
Pierceable Protective Cover For Photonic Connectors App 20220196924 - WALCZYK; Joe F. ; et al.	2022-06-23
Active Optical Plug To Optically Or Electrically Test A Photonics Package App 20220196732 - COONS; Todd R. ; et al.	2022-06-23
Electrical Connector With Insulated Conductive Layer App 20210305196 - JENSEN; Morten ; et al.	2021-09-30
Thermal Switch For Rapid Thermal Coupling And Decoupling Of Devices Under Test App 20200371155 - Walczyk; Joe F. ; et al.	2020-11-26
Sloped Metal Features For Cooling Hotspots In Stacked-die Packages App 20200098666 - WAN; ZHIMIN ; et al.	2020-03-26
Ultra Low-cost, Low Leadtime, And High Density Space Transformer For Fine Pitch Applications App 20200072871 - Tadayon; Pooya ; et al.	2020-03-05
Cooling Apparatuses For Microelectronic Assemblies App 20190385925 - Walczyk; Joe F. ; et al.	2019-12-19
Package testing system and method with contact alignment Grant 10,324,112 - Prabhugoud , et al.	2019-06-18
Package Testing System And Method With Contact Alignment App 20180045759 - Prabhugoud; Mohanraj ; et al.	2018-02-15
Organic space transformer attachment and assembly Grant 9,581,639 - Yang , et al. February 28, 2	2017-02-28
Interconnects including liquid metal Grant 9,523,713 - Oh , et al. December 20, 2	2016-12-20
Mechanism for facilitating a dynamic electro-mechanical interconnect having a cavity for embedding electrical components and isolating electrical paths Grant 9,128,121 - Fledell , et al. September 8, 2	2015-09-08
Organic Space Transformer Attachment And Assembly App 20150185252 - YANG; Jin ; et al.	2015-07-02
Interconnects Including Liquid Metal App 20140354318 - Oh; Youngseok ; et al.	2014-12-04
Thermal Control Of Device Using Fluid Coolant App 20140262129 - LI; Zhihua ; et al.	2014-09-18
Interposer Apparatus And Methods App 20140139247 - Oh; Youngseok ; et al.	2014-05-22
Mechanism For Facilitating A Dynamic Electro-mechanical Interconnect Having A Cavity For Embedding Electrical Components And Isolating Electrical Paths App 20140091824 - Fledell; Evan M. ; et al.	2014-04-03
Substrate Embedded Electrical Interconnect App 20130337666 - Walczyk; Joe F. ; et al.	2013-12-19

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