| Patent | Date |
|---|
Slip-plane MEMs probe for high-density and fine pitch interconnects
Grant 11,372,023 - Walczyk , et al. June 28, 2 | 2022-06-28 |
Dual-sided Socket Device With Corrugation Structures And Shield Structures
App 20220102892 - Nekkanty; Srikant ; et al. | 2022-03-31 |
High density and fine pitch interconnect structures in an electric test apparatus
Grant 11,249,113 - Tadayon , et al. February 15, 2 | 2022-02-15 |
Additively Manufactured Structures For Heat Dissipation From Integrated Circuit Devices
App 20210407884 - Eid; Feras ; et al. | 2021-12-30 |
Integrated Circuit Die Packages Including A Contiguous Heat Spreader
App 20210407877 - Eid; Feras ; et al. | 2021-12-30 |
Hybrid Thermal Interface Material (tim) With Reduced 3d Thermal Resistance
App 20210375716 - Tadayon; Pooya ; et al. | 2021-12-02 |
Hybrid Backside Thermal Structures For Enhanced Ic Packages
App 20210249375 - Eid; Feras ; et al. | 2021-08-12 |
Slip-plane Mems Probe For High-density And Fine Pitch Interconnects
App 20210239734 - Walczyk; Joe ; et al. | 2021-08-05 |
Electrical testing apparatus with lateral movement of a probe support substrate
Grant 11,073,538 - Diglio , et al. July 27, 2 | 2021-07-27 |
High Density And Fine Pitch Interconnect Structures In An Electric Test Apparatus
App 20210088554 - Tadayon; Pooya ; et al. | 2021-03-25 |
Slip-plane MEMS probe for high-density and fine pitch interconnects
Grant 10,935,573 - Walczyk , et al. March 2, 2 | 2021-03-02 |
Deflected-pillar Composite Compliant Elongated Micro-structure Thermal Interface Materials
App 20200411408 - Walczyk; Joe ; et al. | 2020-12-31 |
High density and fine pitch interconnect structures in an electric test apparatus
Grant 10,877,068 - Tadayon , et al. December 29, 2 | 2020-12-29 |
Micro-coaxial Wire Interconnect Architecture
App 20200141979 - Kirby; Ronald Michael ; et al. | 2020-05-07 |
Shielded interconnect array
Grant 10,644,458 - Oh , et al. | 2020-05-05 |
Slip-plane Mems Probe For High-density And Fine Pitch Interconnects
App 20200103440 - Walczyk; Joe ; et al. | 2020-04-02 |
Conformable heat spreader
Grant 10,566,263 - Walczyk , et al. Feb | 2020-02-18 |
High Density And Fine Pitch Interconnect Structures In An Electric Test Apparatus
App 20200025801 - Tadayon; Pooya ; et al. | 2020-01-23 |
High density and fine pitch interconnect structures in an electric test apparatus
Grant 10,488,438 - Tadayon , et al. Nov | 2019-11-26 |
High Density And Fine Pitch Interconnect Structures In An Electric Test Apparatus
App 20190212366 - Tadayon; Pooya ; et al. | 2019-07-11 |
Electrical Testing Apparatus With Lateral Movement Of A Probe Support Substrate
App 20190204358 - Diglio; Paul ; et al. | 2019-07-04 |
Massively-parallel Micronozzle Array For Direct Write Electrodeposition Of High-density Microstructure Arrays
App 20190203370 - Walczyk; Joe ; et al. | 2019-07-04 |
Low profile edge clamp socket
Grant 10,338,099 - Del Barga , et al. | 2019-07-02 |
Conformable Heat Spreader
App 20190096785 - Walczyk; Joe ; et al. | 2019-03-28 |
Low Profile Edge Clamp Socket
App 20180364279 - Del Barga; Christopher ; et al. | 2018-12-20 |
Shielded Interconnect Array
App 20180287305 - Oh; Youngseok ; et al. | 2018-10-04 |
Actuation Mechanisms For Electrical Interconnections
App 20170273176 - Oh; Youngseok ; et al. | 2017-09-21 |
Actuation mechanisms for electrical interconnections
Grant 9,674,943 - Oh , et al. June 6, 2 | 2017-06-06 |
Seal method for direct liquid cooling of probes used at first level interconnect
Grant 9,046,569 - Kirby , et al. June 2, 2 | 2015-06-02 |
Actuation Mechanisms For Electrical Interconnections
App 20140158416 - Oh; Youngseok ; et al. | 2014-06-12 |
Seal Method For Direct Liquid Cooling Of Probes Used At First Level Interconnect
App 20140125367 - Kirby; Ronald ; et al. | 2014-05-08 |
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