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name:-0.0024189949035645
name:-0.0035688877105713
Wakuda; Yohei Patent Filings

Wakuda; Yohei

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wakuda; Yohei.The latest application filed is for "paddle, plating apparatus equipped with the paddle, and plating method".

Company Profile
3.2.4
  • Wakuda; Yohei - Tokyo JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Paddle, Plating Apparatus Equipped With The Paddle, And Plating Method
App 20210154629 - Masuda; Yasuyuki ;   et al.
2021-05-27
Paddle, plating apparatus equipped with the paddle, and plating method
Grant 10,946,351 - Masuda , et al. March 16, 2
2021-03-16
Plating method
Grant 10,468,364 - Wakuda , et al. No
2019-11-05
Plating Method
App 20180282895 - WAKUDA; Yohei ;   et al.
2018-10-04
Paddle, Plating Apparatus Equipped With The Paddle, And Plating Method
App 20180221835 - MASUDA; Yasuyuki ;   et al.
2018-08-09
Plating Method
App 20170278813 - WAKUDA; Yohei ;   et al.
2017-09-28

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