Wakioka; Sayaka

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wakioka; Sayaka.The latest application filed is for "curable resin composition, adhesive, imide oligomer, imide oligomercomposition, and curing agent".

Company Profile

3.6.9

Wakioka; Sayaka - Osaka JP
Wakioka; Sayaka - Mishima-gun Osaka

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Curable resin composition, cured product, adhesive, bonding film, coverlay film, flexible copper-clad laminate and circuit board Grant 11,421,107 - Wakioka , et al. August 23, 2	2022-08-23
Conductive material, connection structure and method for producing connection structure Grant 11,101,052 - Wakioka , et al. August 24, 2	2021-08-24
Curable Resin Composition, Adhesive, Imide Oligomer, Imide Oligomercomposition, And Curing Agent App 20210130536 - TAKEDA; Kohei ; et al.	2021-05-06
Curable Resin Composition, Cured Product, Adhesive, Bonding Film, Coverlay Film, Flexible Copper-clad Laminate And Circuit Board App 20210130614 - WAKIOKA; Sayaka ; et al.	2021-05-06
Curable Resin Composition, Adhesive Agent, Adhesive Film, Circuit Substrate, Interlayer Insulating Material, And Printed Wiring Board App 20210009749 - WAKIOKA; Sayaka ; et al.	2021-01-14
Conductive Material, Connection Structure And Method For Producing Connection Structure App 20190252089 - Wakioka; Sayaka ; et al.	2019-08-15
Adhesive for mounting flip chip for use in a method for producing a semiconductor device Grant 9,748,195 - Wakioka , et al. August 29, 2	2017-08-29
Adhesive For Mounting Electronic Component And Adhesive Film For Mounting Flip Chip App 20160272854 - WAKIOKA; Sayaka	2016-09-22
Method For Manufacturing Semiconductor Device And Adhesive For Mounting Flip Chip App 20160056120 - WAKIOKA; Sayaka ; et al.	2016-02-25
Method for manufacturing semiconductor device and adhesive for mounting flip chip Grant 9,209,155 - Wakioka , et al. December 8, 2	2015-12-08
Method For Manufacturing Semiconductor Device And Adhesive For Mounting Flip Chip App 20150064847 - Wakioka; Sayaka ; et al.	2015-03-05
Adhesive for semiconductor bonding, adhesive film for semiconductor bonding, method for mounting semiconductor chip, and semiconductor device Grant 8,692,394 - Lee , et al. April 8, 2	2014-04-08
Thermosetting Resin Composition, Flip-chip Mounting Adhesive, Semiconductor Device Fabrication Method, And Semiconductor Device App 20120326301 - Wakioka; Sayaka ; et al.	2012-12-27
Adhesive For Semiconductor Bonding, Adhesive Film For Semiconductor Bonding, Method For Mounting Semiconductor Chip, And Semiconductor Device App 20120267803 - Lee; Yangsoo ; et al.	2012-10-25

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