Wakazono; Makoto
Patent Applications and Registrations
Patent applications and USPTO patent grants for Wakazono; Makoto.The latest application filed is for "wiring board".
- Wakazono; Makoto - Niwa-gun JP
- Wakazono; Makoto - Hashima JP
- Wakazono; Makoto - Gifu JP
- Wakazono, Makoto - Hashima-gun JP
- Wakazono, Makoto - Hashima-shi JP
| Patent | Date |
|---|---|
| Wiring board Grant 9,699,905 - Nishida , et al. July 4, 2 | 2017-07-04 |
| Wiring board Grant 9,560,739 - Nishida , et al. January 31, 2 | 2017-01-31 |
| Wiring board having an opening with an angled surface Grant 9,538,650 - Nishida , et al. January 3, 2 | 2017-01-03 |
| Wiring board and method for manufacturing same Grant 9,516,751 - Hayashi , et al. December 6, 2 | 2016-12-06 |
| Wiring substrate having a plurality of connection terminals and a filling member provided therebetween Grant 9,485,853 - Ito , et al. November 1, 2 | 2016-11-01 |
| Wiring board and manufacturing method of the same Grant 9,420,703 - Hayashi , et al. August 16, 2 | 2016-08-16 |
| Wiring Board App 20150334837 - NISHIDA; Tomohiro ; et al. | 2015-11-19 |
| Wiring board Grant 9,179,552 - Nishida , et al. November 3, 2 | 2015-11-03 |
| Wiring substrate and method for producing wiring substrate Grant 9,131,621 - Hayashi , et al. September 8, 2 | 2015-09-08 |
| Wiring Board App 20150223332 - Nishida; Tomohiro ; et al. | 2015-08-06 |
| Wiring Board And Manufacturing Method Of The Same App 20150216059 - Hayashi; Takahiro ; et al. | 2015-07-30 |
| Wiring Board And Method For Manufacturing Same App 20150208501 - Hayashi; Takahiro ; et al. | 2015-07-23 |
| Wiring Board App 20150027750 - Nishida; Tomohiro ; et al. | 2015-01-29 |
| Wiring Substrate And Method For Producing Wiring Substrate App 20140318846 - HAYASHI; Takahiro ; et al. | 2014-10-30 |
| Wiring Substrate App 20140284081 - Nishida; Tomohiro ; et al. | 2014-09-25 |
| Wiring Board App 20140196939 - Nishida; Tomohiro ; et al. | 2014-07-17 |
| Wiring Substrate App 20140124242 - Ito; Tatsuya ; et al. | 2014-05-08 |
| Filling material, multilayer wiring board, and process of producing multilayer wiring board Grant 7,438,969 - Kojima , et al. October 21, 2 | 2008-10-21 |
| Multilayer wiring board Grant 7,183,497 - Kojima , et al. February 27, 2 | 2007-02-27 |
| Multilayer wiring board App 20050126818 - Kojima, Toshifumi ; et al. | 2005-06-16 |
| Filling material, multilayer wiring board, and process of producing multilayer wiring board App 20040009335 - Kojima, Toshifumi ; et al. | 2004-01-15 |
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